SQM40022E_GE3

SQM40022E
www.vishay.com
Vishay Siliconix
S17-1885-Rev. A, 01-Jan-18
1
Document Number: 76543
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Automotive N-Channel 40 V (D-S) 175 °C MOSFET
FEATURES
TrenchFET
®
power MOSFET
Package with low thermal resistance
100 % R
g
and UIS tested
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR4 material)
PRODUCT SUMMARY
V
DS
(V) 40
R
DS(on)
() at V
GS
= 10 V 0.00163
I
D
(A) 150
Configuration Single
Package TO-263
TO-263
Top View
G
D
S
G
D
S
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
40
V
Gate-source voltage V
GS
± 20
Continuous drain current
T
C
= 25 °C
a
I
D
150
A
T
C
= 125 °C 125
Continuous source current (diode conduction)
a
I
S
136
Pulsed drain current
b
I
DM
300
Single pulse avalanche current
L = 0.1 mH
I
AS
60
Single pulse avalanche energy E
AS
180 mJ
Maximum power dissipation
b
T
C
= 25 °C
P
D
150
W
T
C
= 125 °C 50
Operating junction and storage temperature range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount
c
R
thJA
40
°C/W
Junction-to-case (drain) R
thJC
1
SQM40022E
www.vishay.com
Vishay Siliconix
S17-1885-Rev. A, 01-Jan-18
2
Document Number: 76543
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 40 - -
V
Gate-source threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.5 3.0 3.5
Gate-source leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero gate voltage drain current I
DSS
V
GS
= 0 V V
DS
= 40 V - - 1
μA
V
GS
= 0 V V
DS
= 40 V, T
J
= 125 °C - - 50
V
GS
= 0 V V
DS
= 40 V, T
J
= 175 °C - - 300 μA
On-state drain current
a
I
D(on)
V
GS
= 10 V V
DS
5 V 100 - - A
Drain-source on-state resistance
a
R
DS(on)
V
GS
= 10 V I
D
= 35 A - 0.00133 0.00163
V
GS
= 10 V I
D
= 35 A, T
J
= 125 °C - - 0.00268
V
GS
= 10 V I
D
= 35 A, T
J
= 175 °C - - 0.00326
Forward transconductance
b
g
fs
V
DS
= 15 V, I
D
= 35 A - 143 - S
Dynamic
b
Input capacitance C
iss
V
GS
= 0 V V
DS
= 25 V, f = 1 MHz
- 6783 9200
pF Output capacitance C
oss
- 1771 2400
Reverse transfer capacitance C
rss
- 109 150
Total gate charge
c
Q
g
V
GS
= 10 V V
DS
= 20 V, I
D
= 100 A
- 106 160
nC Gate-source charge
c
Q
gs
-33-
Gate-drain charge
c
Q
gd
-21-
Gate resistance R
g
f = 1 MHz 1.25 2.75 4.35
Turn-on delay time
c
t
d(on)
V
DD
= 20 V, R
L
= 0.2
I
D
100 A, V
GEN
= 10 V, R
g
= 1
-1930
ns
Rise time
c
t
r
- 194 300
Turn-off delay time
c
t
d(off)
-4570
Fall time
c
t
f
-2640
Source-Drain Diode Ratings and Characteristics
b
Pulsed current
a
I
SM
- - 300 A
Forward voltage V
SD
I
F
= 60 A, V
GS
= 0 V - 0.83 1.5 V
Body diode reverse recovery time t
rr
I
F
= 30 A, di/dt = 100 A/μs
- 88 180 ns
Body diode reverse recovery charge Q
rr
- 186 380 nC
Reverse recovery fall time t
a
-57-
ns
Reverse recovery rise time t
b
-31-
Body diode peak reverse recovery current I
RM(REC)
--4.6- A
SQM40022E
www.vishay.com
Vishay Siliconix
S17-1885-Rev. A, 01-Jan-18
3
Document Number: 76543
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
Transconductance
Capacitance
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
40
80
120
160
200
0246810
2nd line
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
2nd line
V
GS
= 6 V thru 10 V
V
GS
= 4 V
V
GS
= 5 V
10
100
1000
10000
0
40
80
120
160
200
0 1020304050
Axis Title
1st line
2nd line
2nd line
g
fs
- Transconductance (S)
I
D
- Drain Current (A)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
2400
4800
7200
9600
12 000
0 8 16 24 32 40
Axis Title
1st line
2nd line
2nd line
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
2nd line
C
rss
C
oss
C
iss
10
100
1000
10000
0
25
50
75
100
125
0246810
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
0.000
0.001
0.002
0.003
0.004
0.005
0 20406080100
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
2nd line
V
GS
= 10 V
10
100
1000
10000
0
2
4
6
8
10
0 306090120150
Axis Title
1st line
2nd line
2nd line
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
2nd line
I
D
= 100 A
V
DS
= 20 V

SQM40022E_GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 40V Vds 20V Vgs D2PAK (TO-263)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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