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LBP01-0810B

P1-P3P4-P6P7-P8
Package information LBP01
4/8 Doc ID 022950 Rev 1
3 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 3. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
Figure 5. Footprint, dimensions in mm
(inches)
Figure 6. Marking
(1)
1. Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product
marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this
purpose.
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.23)
(0.064)
(0.086)
y w wz
x x x
ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
LBP01 Package information
Doc ID 022950 Rev 1 5/8
Table 4. SOT23-5L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.45 0.035 0.057
A1 0 0.10 0 0.004
A2 0.90 1.30 0.035 0.051
b 0.35 0.50 0.014 0.020
c 0.09 0.20 0.004 0.008
D 2.80 3.05 0.11 0.118
E 1.50 1.75 0.059 0.069
e0.95 0.037
H 2.60 3.00 0.102 0.118
L 0.10 0.60 0.004 0.024
M 0° 10° 0° 10°
Figure 7. Footprint, dimensions in mm
(inches)
Figure 8. Marking
A2
A
L
H
c
b
E
D
e
e
A1
q
1.10
(0.043)
0.95
(0.037)
2.30
(0.091)
3.50
(0.138)
1.20
(0.047)
0.60
(0.024)
x x x
x
Recommendations on PCB assembly LBP01
6/8 Doc ID 022950 Rev 1
4 Recommendations on PCB assembly
4.1 PCB design
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Figure 9. Printed circuit board layout
4.2 Reflow profile
Figure 10. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
60 sec
(90 max)
250
0
50
100
150
200
240210180150120906030 300
270
-2 °C/s to
-3 °C/s
-6 °C/s max
240-245 °C
2 - 3 °C/s
0.9 °C/s
Temperature (°C)
Time (s)
P1-P3P4-P6P7-P8

LBP01-0810B

Mfr. #:
Buy LBP01-0810B
Manufacturer:
STMicroelectronics
Description:
LED Protection Devices LED Bypass 100nA 1A 15kV 8kV BI
Lifecycle:
New from this manufacturer.
Delivery:
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