IRFR2405PbF
IRFU2405PbF
HEXFET
®
Power MOSFET
Seventh Generation HEXFET
®
Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-
hole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
S
D
G
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 56
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 40 A
I
DM
Pulsed Drain Current 220
P
D
@T
C
= 25°C Power Dissipation 110 W
Linear Derating Factor 0.71 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 130 mJ
I
AR
Avalanche Current 34 A
E
AR
Repetitive Avalanche Energy 11 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
V
DSS
= 55V
R
DS(on)
= 0.016
I
D
= 56A
Description
12/03/04
www.irf.com 1
l Surface Mount (IRFR2405)
l Straight Lead (IRFU2405)
l Advanced Process Technology
l Dynamic dv/dt Rating
l Fast Switching
l Fully Avalanche Rated
l Lead-Free
PD - 95369A
D-Pak I-Pak
IRFR2405 IRFU2405
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.4
R
θJA
Junction-to-Ambient (PCB mount)* –– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
Thermal Resistance
* When mounted on 1" square PCB (FR-4 or G-10 Material) .
For recommended footprint and soldering techniques refer to application note #AN-994
2 www.irf.com
IRFR/U2405OPbF
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.052 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– 0.0118 0.016 V
GS
= 10V, I
D
= 34A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= 10V, I
D
= 250µA
g
fs
Forward Transconductance 30 ––– ––– S V
DS
= 25V, I
D
= 34A
––– ––– 20
µA
V
DS
= 55V, V
GS
= 0V
––– ––– 250 V
DS
= 44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 200 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -200
nA
V
GS
= -20V
Q
g
Total Gate Charge –– 70 110 I
D
= 34A
Q
gs
Gate-to-Source Charge ––– 16 23 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 19 29 V
GS
= 10V
t
d(on)
Turn-On Delay Time ––– 15 ––– V
DD
= 28V
t
r
Rise Time ––– 130 –– I
D
= 34A
t
d(off)
Turn-Off Delay Time ––– 55 ––– R
G
= 6.8
t
f
Fall Time ––– 78 ––– V
GS
= 10V
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 2430 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 470 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 100 –– ƒ = 1.0MHz, See Fig. 5
C
oss
Output Capacitance ––– 2040 –– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 350 ––– V
GS
= 0V, V
DS
= 44V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 350 ––– V
GS
= 0V, V
DS
= 0V to 44V
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature.
I
SD
34A, di/dt 190A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Notes:
Starting T
J
= 25°C, L = 0.22mH
R
G
= 25, I
AS
= 34A.
Pulse width 300µs; duty cycle 2%.
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 34A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 62 93 ns T
J
= 25°C, I
F
= 34A
Q
rr
Reverse RecoveryCharge ––– 170 260 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
56
220
A
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 30A
www.irf.com 3
IRFR/U2405PbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
10
100
1000
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V = 25V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
56A

IRFU2405PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 55V 56A 16mOhm 70nC
Lifecycle:
New from this manufacturer.
Delivery:
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