BUK7604-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 31 May 2010 3 of 14
NXP Semiconductors
BUK7604-40A
N-channel TrenchMOS standard level FET
4. Limiting values
[1] Current is limited by power dissipation chip rating.
[2] Continuous current is limited by package.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Typ Max Unit
V
DS
drain-source voltage T
j
25 °C; T
j
175°C --40V
V
DGR
drain-gate voltage R
GS
=20k --40V
V
GS
gate-source voltage -20 - 20 V
I
D
drain current T
mb
=2C; V
GS
=10V;
see Figure 3; see Figure 1
[1]
- - 198 A
T
mb
=10C; V
GS
= 10 V; see Figure 1
[2]
--75A
T
mb
=2C; V
GS
=10V;
see Figure 3
; see Figure 1
[2]
--75A
I
DM
peak drain current T
mb
=2C; t
p
10 µs; pulsed;
see Figure 3
- - 794 A
P
tot
total power dissipation T
mb
=2C; see Figure 2 - - 300 W
T
stg
storage temperature -55 - 175 °C
T
j
junction temperature -55 - 175 °C
Source-drain diode
I
S
source current T
mb
=2C
[1]
- - 198 A
[2]
--75A
I
SM
peak source current t
p
10 µs; pulsed; T
mb
= 25 °C - - 794 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive
drain-source
avalanche energy
I
D
=75A; V
sup
40 V; R
GS
=50;
V
GS
=10V; T
j(init)
= 25 °C; unclamped
--1.6J
BUK7604-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 31 May 2010 4 of 14
NXP Semiconductors
BUK7604-40A
N-channel TrenchMOS standard level FET
Fig 1. Normalized continuous drain current as a
function of mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
03ne93
0
50
100
150
200
25 50 75 100 125 150 175 200
T
mb
(°C)
I
D
(A)
Capped at 75 A due to package
T
mb
(°C)
0 20015050 100
03na19
40
80
120
P
der
(%)
0
03ne68
1
10
10
2
10
3
1 10 102
V
DS
(V)
I
D
(A)
DC
100 ms
10 ms
R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10 μs
100 μs
Capped at 75 A due to package
BUK7604-40A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 31 May 2010 5 of 14
NXP Semiconductors
BUK7604-40A
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance
from junction to
mounting base
see Figure 4 --0.5K/W
R
th(j-a)
thermal resistance
from junction to
ambient
mounted on printed-circuit board ;
minimum footprint
-50-K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
03ne69
Single Shot
0.2
0.1
0.05
0.02
10
3
10
2
10
1
1
10
6
10
5
10
4
10
3
10
2
10
1
1
t
p
(s)
Z
th(j-mb)
(K/W)
δ = 0.5
t
p
t
p
T
P
t
T
δ =

BUK7604-40A,118

Mfr. #:
Manufacturer:
Nexperia
Description:
RF Bipolar Transistors MOSFET TAPE13 MOSFET
Lifecycle:
New from this manufacturer.
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