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E-L5970D

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
Application circuit L5970D
10/16
Figure 15. PCB layout (component side)
Figure 16. PCB layout (bottom side)
Figure 17. PCB layout (front side)
L5970D Application ideas
11/16
6 Application ideas
Figure 18. Dual output voltage with auxiliary winding
Figure 19. Buck-boost regulator
Figure 20. Positive Buck-Boost regulator
Figure 21. Synchronization example
VIN=12V
C1
10uF
25V
Ceramic
D1
STPS25L25U
VCC
COMP
GND
OUT
FB
INH
SYNC VREF
L5970D
1
3
7
5
6
4
8
2
R3
4.7k
U1
C3
22nF
3.3V
VOUT=3.3V
0.5A
C2
220pF
VOUT1=5V
30mA
C5
47uF
10V
Lp=22uH
D2
1N4148
C4
100uF
10V
N1/N2=2
VIN=12V
C1
10uF
25V
Ceramic
D1
STPS2L25U
VCC
COMP
GND
OUT
FB
INH
SYNC
VREF
1
3
7
5
6
4
8
2
R3
4.7k
U1
L1
33uH
2.7k
24k
C4
22nF
3.3V
C5
100uF
16V
L5970
VOUT=-12V/0.3A
C3
220pF
C2
10uF
35V
Ceramic
Vin=12V Vout=-12V Iout=0.5A Efficiency=81%
VIN=5V
C1
10uF
25V
Ceramic
D1
STPS2L25U
VCC
COMP
GND
OUT
FB
INH
SYNC VREF
L5970
1
3
7
5
6
4
8
2
R3
4.7k
U1
L1
33uH
24k
2.7k
C3
22nF
3.3V
C4
100uF
16V
VOUT=12V/0.3A
C2
220pF
D2
STPS2L25U
M1
STN4NE03L
Vin=5V Vout=12V Iout=0.3A Efficiency=76%
VCC
GND
OUT
FB
INH
SYNC VREF
1
3
7
5
6
4
8
2
L5970D
COMP
VCC
GND
OUT
FB
INH
SYNC VREF
1
3
7
5
6
4
8
2
L5970D
COMP
VIN
Package mechanical data L5970D
12/16
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

E-L5970D

Mfr. #:
Buy E-L5970D
Manufacturer:
STMicroelectronics
Description:
IC REG BUCK ADJUSTABLE 1A 8SO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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