- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free and RoHS compliant
- Case: Bend lead SOT-23 small outline plastic package
- Polarity: Indicated by cathode band
- Weight: 8 ± 0.5 mg
- Marking Code: KL1,KL2,KL3,KL4
V
RRM
V
RWM
V
R
I
F
mA
I
FRM
mA
I
FSM
mA
Pd mW
R
θJA
°C/W
T
j
, T
STG
°C
SYMBOL UNIT
V
(BR)
V
V
V
V
V
V
I
R
µA
C
T
pF
t
rr
ns
Document Number: DS_S1404001
BAT54 / A / C / S
Taiwan Semiconductor
Small Signal Product
230mW SMD Schottky Barrier Diode
FEATURES
- Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
Forward Continuous Current
Repetitive Peak Forward current (tp≤1S;δ≤0.5)
PARAMETER
10--
Reverse Current
1.00
0.32
Reverse Breakdown Voltage
Forward Voltage
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
Peak Pepetitive Peak Reverse Voltage
V
DC Reverse Voltage
Working Peak Reverse Voltage
300
200
30
--
MIN MAX
600
V
F
--
Operating and Storage Temperature -55 to 125
500
200
0.24
2.0
0.40
0.50
Forward Surge Current @ t<1.0s
Power Dissipation
Thermal Resistance, Junction to Ambient
V
R
=25V
V
R
=1V, f=1.0MHz
I
F
=I
R
=10mA, R
L
=100Ω, I
RR
=1mA
5
30
--
--
--
--
--
Version: E14
Total Capacitance
Reverse Recovery Time --
I
R
=100µA
I
F
=0.1mA
I
F
=1mA
I
F
=10mA
I
F
=30mA
I
F
=100mA
