Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC166 –
E F O 4004
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
4004
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Built-In Capacitors
Type with 3-terminals
SS
SM
BM
JM
4to13MHz
4to13MHz
12 to 20 MHz
16 to 20 MHz
30 to 50 MHz
4.00 MHz
16.93 MHz
20.00 MHz
40.00 MHz
(Example)
123456789101112
1695
2005
4005
E F O 3584
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
3584
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Built-In Capacitors
Type with 3-terminals
S
B
2to13MHz
13.1 to 20 MHz
3.58 MHz
(Example)
123456789101112
1695 16.93 MHz
Ceramic Res o na tors, Chip Type
(3 Array Type)
Type:
EFOS
Type:
EFOB
Type:
EFOSS
Type:
EFOSM
Type:
EFOBM
Type:
EFOJM
■ Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum (SS/SM/BM/JM),
● Designed for refl ow soldering
● Flat-bottom plate for better mountings
● Simplifi es oscillation circuits by reducing the number
of circuit parts
● RoHS compliant
■ Handling Precautions
(See Page 175 to 176)
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
■ Explanation of Part Numbers
Part Number
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Built-in Capacitors
(Reference)
EFOS
2.00 to 8.39 ±0.2 %
33 pF
8.40 to 13.0 ±1.0 %
EFOB
13.1 to 20.0 ±0.5 % 33 pF
EFOSS
4.00 to 8.39 ±0.2 %
21 pF
8.40 to 13.0 ±0.3 %
EFOSM
4.00 to 8.39 ±0.2 %
33 pF
8.40 to 13.0 ±1.0 %
EFOBM
12.0 to 20.0 ±0.3 % 18 pF
EFOJM
16.0 to 20.0 ±0.5 %
10 pF
30.0 to 50.0 ±0.2 %
■ Packaging Specifi cations
See Page 169 to 177
01 Feb. 2009