CY2308
Document Number: 38-07146 Rev. *H Page 13 of 15
Package Drawings and Dimensions
PIN 1 ID
~8°
16 Lead (150 Mil) SOIC
18
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
51-85068-*B
Figure 7. 16-Pin (150 Mil) SOIC S16.15
4.90[0.193]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
16
PIN1ID
6.50[0.256]
SEATING
PLANE
1
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
BSC.
5.10[0.200]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
BSC
0.25[0.010]
-8°
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
PLANE
GAUGE
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.05 gms
PART #
Z16.173 STANDARD PKG.
ZZ16.173 LEAD FREE PKG.
51-85091-*A
Figure 8. 16-Pin TSSOP 4.40 mm Body Z16.173
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CY2308
Document Number: 38-07146 Rev. *H Page 14 of 15
Document History Page
Document Title: CY2308 3.3V Zero Delay Buffer
Document Number: 38-07146
Rev. ECN
Orig. of
Change
Submission
Date
Description of Change
** 110255 SZV 12/17/01 Changed from Specification number: 38-00528 to 38-07146
*A 118722 RGL 10/31/02 Added Note 1 in page 2.
*B 121832 RBI 12/14/02 Power up requirements added to Operating Conditions Information
*C 235854 RGL 06/24/04 Added Pb-Free Devices
*D 310594 RGL 02/09/05 Removed obsolete parts in the ordering information table
Specified typical value for cycle-to-cycle jitter
*E 1344343 KVM/VED 08/20/07 Brought the Ordering Information Table up to date: removed three obsolete parts
and added two parts
Changed titles to tables that are specific to commercial and industrial temperature
ranges
*F 2568575 AESA 09/19/08 Updated template. Added Note “Not recommended for new designs.”
Changed IDD (PD mode) from 12.0 to 25.0 μA for Commercial and Industrial
Temperature Devices
Deleted Duty Cycle parameters for F
out
< 50 MHz
Removed CY2308SI-4, CY2308SI-4T and CY2308SC-5HT.
*G 2632364 KVM 01/08/09 Corrected TSSOP package size (from 150 mil to 4.4 mm) in Ordering Information
table
*H 2673353 KVM/PYRS 03/13/09 Reverted IDD (PD mode) and Duty Cycle parameters back to the values in
revision *E:
Changed IDD (PD mode) from 25 to 12 μA for commercial temperature devices
Added Duty Cycle parameters for F
out
< 50 MHz for commercial and industrial
devices.
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Document Number: 38-07146 Rev. *H Revised March 12, 2009 Page 15 of 15
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CY2308
© Cypress Semiconductor Corporation, 2001-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
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a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
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CY2308SXC-5HT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
Clock Buffer 3.3VZDB COM
Lifecycle:
New from this manufacturer.
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