Specifications Features
•
On Dimm Thermal Sensor:
No
• Double-data-rate architecture; two data transfers per
• Density: 4GB
clock cycle
• Organization
• The high-speed data transfer is realized by the 8 bits
prefetch pipelined architecture
512M words × 64 bits, 2 ranks
• Bi-directional differential data strobe (DQS and /DQS)
• Mounting 16 pieces of 2G bits DDR3 SDRAM sealed
is transmitted/received with data for capturing data at
in FBGA
the receiver
• Package: 204-pin socket type small outline dual in
• DQS is edge-aligned with data for READs; center-
line memory module (SO-DIMM)
aligned with data for WRITEs
PCB height: 30.0mm
• Differential clock inputs (CK and /CK)
Lead pitch: 0.6mm (pin)
• DLL aligns DQ and DQS transitions with CK
Lead-free (RoHS compliant)
transitions
• Power supply: VDD = 1.5V ± 0.075V
• Commands entered on each positive CK edge; data
• Eight internal banks for concurrent operation
and data mask referenced to both edges of DQS
(components)
• Data mask (DM) for write data
• Interface: SSTL_15
• Posted /CAS by programmable additive latency for
• Burst lengths (BL): 8 and 4 with Burst Chop (BC)
better command and data bus efficiency
• /CAS Latency (CL):
6, 7, 8, 9, 10, 11
• On-Die-Termination (ODT) for better signal quality
• /CAS write latency (CWL):
5, 6, 7, 8
Synchronous ODT
• Precharge: auto precharge option for each burst
Dynamic ODT
access
Asynchronous ODT
• Refresh: auto-refresh, self-refresh
• Multi Purpose Register (MPR) for temperature read
• Refresh cycles
out
Average refresh period
• ZQ calibration for DQ drive and ODT
7.8µs at 0°C ≤ TC ≤ +85°C
• Programmable Partial Array Self-Refresh (PASR)
3.9µs at +85°C < TC ≤ +95°C
• /RESET pin for Power-up sequence and reset
• Operating case temperature range
function
TC = 0°C to +95°C
• SRT range:
Normal/extended
Auto/manual self-refresh
• Programmable Output driver impedance control
Apacer Memory Product Specification
4GB DDR3 SDRAM SODIMM with SPD
Ordering Information
Part Number Bandwidth Speed Grade Max Frequency CAS Latency Density Organization
Component
Composition
Number of
Rank
78.B2GCJ.AF10C
4GB 512Mx64 256Mx8*16EA 2
12.8GB/sec
1600Mbps
800MHz CL11
