Enhanced Product AD8037-EP
Rev. 0 | Page 5 of 8
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 12.6 V
Power Dissipation See Figure 2
Voltage Swing × Bandwidth Product 350 V-MHz
Common-Mode Input Voltage ±V
S
|V
H
– V
IN
| ≤6.3 V
|V
L
– V
IN
| ≤6.3 V
Differential Input Voltage ±1.2 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −55°C to +105°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
R-8 155 °C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by these devices
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150
o
C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of 175
o
C for an extended period can result in
device failure.
Although the AD8037-EP is internally short-circuit protected,
this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to observe
the maximum power derating curves.
MAXIMUM POWER DISSIP
TION (W)
AMBIENT TEMPERATURE (°C)
13760-002
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
