© Semiconductor Components Industries, LLC, 2012
November, 2012 Rev. 9
1 Publication Order Number:
NB3H83905C/D
NB3H83905C
1.8V/2.5V/3.3V Crystal Input
to 1:6 LVTTL/LVCMOS Clock
Fanout Buffer with OE
Description
The NB3H83905C is a 1.8 V, 2.5 V or 3.3 V V
DD
core Crystal input
to 1:6 LVTTL/LVCMOS fanout buffer with outputs powered by
flexible 1.8 V, 2.5 V, or 3.3 V supply V
DDO
(with V
DD
w V
DDO
). The
device accepts a fundamental Parallel Resonant crystal from 3 MHz to
40 MHz or a singleended LVCMOS Clock from up to 100 MHz.
Two synchronous LVTTL/LVCMOS Enable lines permit
independent control over outputs BCLK[0:4] and output BCLK5;
enabling or disabling only when the output is in LOW state
eliminating potential output glitching or runt pulse generation. When
unused, leave floating open, pins will default to HIGH state.
The 6 outputs drive 50 W series or parallel terminated transmission
lines. Parallel termination should be to 1/2 V
CC
. Series terminated
lines can drive 2 loads each, or 12 lines total.
Fit, Form, and Function compatible with ICS83905 and PI6C10806.
Features
Six Copies of LVTTL/LVCMOS Output Clock
Supply Operation V
DD
w V
DDO
:
1.8 V$0.2 V, 2.5 V $5% or 3.3 V $5% Core V
DD
1.8 V$0.2 V, 2.5 V $5%, or 3.3 V $5% Output V
DDO
Crystal Oscillator Interface
Crystal Input Frequency Range: 3 MHz to 40 MHz
Clock Input Frequency Range: Up to 100 MHz
LVCMOS compatible Enable Inputs
5 V Tolerant Enable Inputs
Low Output to Output Skew: 80 ps Max
Synchronous Output Enable
Phase Noise Floor 160 dBc (1 MHz)
Industrial Temperature Range
These are PbFree Devices
Figure 1. Simplified Block Diagram
BCLK0
BCLK1
BCLK2
BCLK3
BCLK4
BCLK5
SYNC
SYNC
XTAL_IN/CLK
XTAL_OUT
C1
C2
ENABLE1
ENABLE2
MARKING
DIAGRAMS*
*For additional marking information, refer to
Application Note AND8002/D.
SOIC16
D SUFFIX
CASE 751B
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
TSSOP16
DT SUFFIX
CASE 948F
(*Note: Microdot may be in either location)
QFN20
MN SUFFIX
CASE 485BH
1
16
NB3H
905C
ALYWG
G
1
16
A = Assembly Location
L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = PbFree Package
NB3H83905G
ALYYWW
1
16
1
NB3H
83905
ALYWG
G
1
20
NB3H83905C
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2
Figure 2. Pinout Configuration (Top View)
1
XTAL_OUT
16
XTAL_IN/CLK
2
ENABLE2
3
GND
4
BCLK0
15
ENABLE1
14
BCLK5
13
V
DDO
SOIC16/TSSOP16
5 12
6
7
8
11
10
9
V
DDO
BCLK4
BCLK1
GND
BCLK2
GND
BCLK3
V
DD
BCLK5
V
DDO
BCLK4
GND
GND
GND
GND
BCLK0
V
DDO
BCLK1
ENABLE2
XTAL_OUT
XTAL_IN/CLK
ENABLE1
NC
GND
GND
BCLK2
V
DD
BCLK3
QFN20
1
2
3
4
5
15
14
13
12
11
109876
1617181920
EP
Exposed Pad
Table 1. PIN DESCRIPTION
SOIC16 /
TSSOP16
QFN20 Name I/O Description
1 19 XTAL_OUT Crystal Interface Oscillator Output to drive Crystal
2 20 ENABLE 2 LVTTL /
LVCMOS Input
Synchronous Enable Input for BCLK5 Output. Switches only when
HIGH. Open default condition HIGH due to an internal pullup resistor
to V
CC
.
3, 7, 11 1, 2, 6, 7,
11, 12
GND GND GND Supply pins. All GND, V
DD
and V
DDO
pins must be externally
connected to power supply to guarantee proper operation.
4, 6, 8,
10, 12, 14
3, 5, 8,
10, 13, 15
BCLK0, 1,
2, 3, 4, 5
LVCMOS
Outputs
Buffered Clock Outputs
5, 13 4, 14 V
DDO
POWER Positive Supply voltage for outputs. All GND, V
DD
and V
DDO
pins
must be externally connected to power supply to guarantee proper
operation. Bypass with 0.01 mF cap to GND.
9 9 V
DD
POWER Positive Supply voltage for core. All GND, V
DD
and V
DDO
pins must
be externally connected to power supply to guarantee proper
operation. Bypass with 0.01 mF cap to GND.
16 NC No Connect
15 17 ENABLE 1 LVTTL /
LVCMOS Input
Synchronous Enable Input for BCLK0/1/2/3/4 Output block. Switches
only when HIGH. Open default condition HIGH due to an internal
pullup resistor to V
CC
16 18 XTAL_IN/
CLK
Crystal Interface Oscillator Input from Crystal. Single ended Clock Input.
EP The Exposed Pad (EP) on the QFN20 package bottom is thermally
connected to the die for improved heat transfer out of package. The
exposed pad must be attached to a heatsinking conduit. The pad is
not electrically connected to the die, but is recommended to be
electrically and thermally connected to GND on the PC board.
NB3H83905C
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3
Table 2. CLOCK ENABLE FUNCTION TABLE
Control Inputs Outputs
ENABLE1* ENABLE2* BCLK0:BCLK4 BCLK5
0 0 LOW LOW
0 1 LOW Toggling
1 0 Toggling LOW
1 1 Toggling Toggling
*Defaults HIGH when floating open.
Figure 3. ENABLEx Control Timing Diagram
BCLK5
BCLK0:4
ENABLE2
ENABLE1
The ENABLEx control inputs will synchronously enable or disable the selected output(s). This control detects the falling
edge of the internal signal and asserts or deasserts the output after 3 clock cycles. When ENABLEx is LOW, the outputs are
disabled to a LOW state. When ENABLEx is HIGH, the outputs are enabled to toggle.
Table 3. RECOMMENDED CRYSTAL PARAMETERS
Crystal Fundamental ATCut
Frequency 10 to 40 MHz
Load Capacitance* 1620 pF
Shunt Capacitance, C0 7 pF Max
Equivalent Series Resistance
50 W Max
Drive Level 1 mW
*See APPLICATION INFORMATION; Crystal Input Interface for CL loading
Table 4. ATTRIBUTES (Note 1)
Characteristics Value
ESD Protection Human Body Model
Machine Model
> 2 kV
> 200 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1
Flammability Rating
Oxygen Index
UL94 code V0 A 1/8”
28 to 34
Transistor Count 213 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.

NB3H83905CDTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1.8V/2.5V/3.3 V BUFFER
Lifecycle:
New from this manufacturer.
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