Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-2
Panasonic Electronic Devices Co., Ltd.
Item Rated Value Explanation
Resistance
tolerance
Range of rated
resistance for
manufacture
4. Explanation of part number
E X B 2 8 N 1 0 2 J X
Thick Film
Resistor Networks
Rated Resistance Tolerance
Taping
Chip Resistor Array
R 0 0 0
Chip Jumper
Packaging Code
Taping
(10,000pcs/reel)
X
5. Appearance & Construction
Item Specifications Explanation
Appearance &
Construction
1. The resistive element should be covered with protective coating
that do not fade easily. The surface of coating should avoid
unevenness, flaw, pinhole and discoloration.
2. The electrode should be printed uniformly, as shown in the
dimensions. The plating should not fade easily, and should avoid
unevenness, flaw, pinhole, projection and discoloration.
3. The electrode should be connected electrically, mechanically to
resistive element.
4. Substrate should not have chipping, flaw, flash and crack. Details
of appearance criteria shall be as described in attached sheet
As far as there shall be not designation especially, the following test and measurement shall be
operated under normal temperature(15 °C to 35 °C), normal humidity(25 %RH to 75 %RH),
normal atmospheric pressure(86 kPa to 106 kPa).
Sign Tolerance for resistance
J ±5%
0 Chip Jumper
Tolerance Resistance range Series
J 10 Ω to 1.0 MΩ E-24
0 Less than50 mΩ -
Part No. 28N
Circuit
1234
8765