EXB-28N330JX

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-7
Panasonic Electronic Devices Co., Ltd.
14. Tape and Reel Package
14-1. Physical Dimensions
Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
14-2. Carrier Tape Dimensions
Sprocket hole
Chip hole
P1
P0
P2
A
φ
D0
E
W
F
T
B
Chip resistor array
A B W F E
(mm) 1.20±0.10 2.20±0.10 8.00±0.20 3.50±0.05 1.75±0.10
P1 P2 P0 T φD0
(mm)
2.00±0.10 2.00±0.05 4.00±0.10 0.52±0.05
1.50
14-3. Specification
14-3-1. Taping
(1) When the test shall be operated with the below conditions, peel strength should be
0.049N
to 0.49N, should not have flash and tear after peeling.
<Test Method>
(2) Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip
and no break of carrier tape. However minimum bending radius shall be tested for 1
times.
+0.10
0
Peeling Direction
Top Tape
10°
Carrier Tape
Carrier ta
p
e
To
p
ta
p
e
Adhesive ta
p
e
Unit : mm
Min. 60.0
11.4 +/- 1.0
9.0 +/- 1.0
180.0 +0 / -3.0
13.0 +/- 1.0
Min. 60.0
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28N03DE
Part No.
EXB28N
8-8
Panasonic Electronic Devices Co., Ltd.
(3) Resistance to climate
When resistors shall be exposed at 60 °C ± 2 °C, 90 %RH to 95 %RH for 120 hours, no
defection of chip and no break off carrier tape.
When the top tape shall be peeled, tape should not have flash and tear.
14-3-2. Quantity in Taping: 10,000 pcs. / reel
14-3-3. Tape packaging
(1) Resistor side shall be facing upward.
(2) Chip resistor shall not be sticking to top tape and bottom tape.
(3) Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole
shall not have flash and break.
14-4. Outer Packaging
Quantity: 20 reels(Max.200,000 pcs.)
Tape
Marking
(1) When packaging quantity does not reach max quantity, the remaining empty space shall
be buried with buffer material.
(2) When quantity shall be few, alternative packaging methods may used. No problem must
occur during the exportation of the product..
14-5. Marking
At last, production country is displayed in English.
Side of reel (Marking shall be on one side.)
(1)Part name (2)Part number (3)Quantity (4)Lot number (5)Maker name
(6)Production country
Packaging box
(1)Customer name (2)Part name (3)Part number (4)Customer part number
(5)Quantity (6)Maker name (7) Production country
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
Attached Sheet
APPEARANCE QUALITY CRITERIA
1-1
Panasonic Electronic Devices Co., Ltd.
Item Defect Criteria Appearance Criteria Remark
Resin Chipping
W
B
C
A
A W/16
B C/2
Both side chipping
shall be judged defect
Terminal Chipping
Oblique line show
chipping
A
C
B
D
B
A C/4
B Top terminal width
D 3C/4
Pin Hole
φ
One pin hole /
chip resistor
φ 0.2 mm
This item is applied to
pin holes which reach
to the resistive
materials
Flash
A
A
A 100 μm

EXB-28N330JX

Mfr. #:
Manufacturer:
Panasonic
Description:
Resistor Networks & Arrays 0402 33ohm 4Res Convex Term AEC-Q200
Lifecycle:
New from this manufacturer.
Delivery:
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