SP8M3TB

SP8M3
Transistors
Rev.A 1/5
Switching
SP8M3
zFeatures
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small and Surface Mount Package (SOP8).
zApplication
Power switching, DC / DC converter.
zExternal dimensions (Unit : mm)
SOP8
Each lead has same dimensions
5.0±0.2
0.2±0.1
6.0±0.3
3.9±0.15
0.5±0.1
(
1
)
(
4
)
(
8
)
(
5
)
Max.1.75
1.27
0.15
0.4±0.1
1.5±0.1
0.1
zAbsolute maximum ratings (Ta=25°C)
Parameter
V
V
DSS
Symbol
30
V
V
GSS
20
A
I
D
±5.0
A
I
DP
±20
A
I
S
1.6
A
I
SP
20
W
P
D
2
°C
Tch
150
°C
Tstg
55 to +150
Nchannel
30
20
±4.5
±18
1.6
18
Pchannel
Limits
Unit
1 Pw10µs, Duty cycle1%
2 MOUNTED ON A CERAMIC BOARD.
Drain-source voltage
Gate-source voltage
Drain current
Total power dissipation
Channel temperature
Storage temperature
Continuous
Pulsed
Continuous
Source current
(Body diode)
Pulsed
1
1
2
zEquivalent circuit
A protection diode is included between the gate and
the source terminals to protect the diode against static
electricity when the product is in use. Use the protection
circuit when the fixed voltages are exceeded.
(1) Tr1 (Nch) Source
(2) Tr1 (Nch) Gate
(3) Tr2 (Pch) Source
(4) Tr2 (Pch) Gate
(5) Tr2 (Pch) Drain
(6) Tr2 (Pch) Drain
(7) Tr1 (Nch) Drain
(8) Tr1 (Nch) Drain
(1) (2) (3) (4)
(8) (7) (6) (5)
2
1
(8) (7)
(1) (2)
2
1
(6) (5)
(3) (4)
1 ESD PROTECTION DIODE
2 BODY DIODE
zThermal resistance (Ta=25°C)
°C / W
Rth (ch-a) 62.5
Parameter
Symbol Limits Unit
Channel to ambient
MOUNTED ON A CERAMIC BOARD.
SP8M3
Transistors
Rev.A 2/5
N-ch
zElectrical characteristics (Ta=25°C)
Parameter Symbol
I
GSS
Y
fs
Min.
−−10 µAV
GS
=20V, V
DS
=0V
V
DD
15V
Typ. Max.
Unit
Conditions
V
(BR) DSS
30 −−VI
D
=1mA, V
GS
=0V
I
DSS
−−1 µAV
DS
=30V, V
GS
=0V
V
GS (th)
1.0 2.5 V V
DS
=10V, I
D
=1mA
36 51 I
D
=5.0A, V
GS
=10V
R
DS (on)
52 73 m I
D
=5.0A, V
GS
=4.5V
58 82 I
D
=5.0A, V
GS
=4V
3.0 −−SI
D
=5.0A, V
DS
=10V
C
iss
230 pF V
DS
=10V
C
oss
80
50
pF V
GS
=0V
C
rss
6
pF f=1MHz
V
GS
=10V
R
L
=6.0
R
G
=10
t
d (on)
8
ns
t
r
22
ns
t
d (off)
5
ns
t
f
3.9
ns
Q
g
1.1
5.5 nC
Q
gs
1.4
nC V
GS
=5V
Q
gd
−−nC I
D
=5.0A
I
D
=2.5A, V
DD
15V
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
Pulsed
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
V
SD
−−1.2 V I
S
=6.4A, V
GS
=0V
Parameter Symbol
Min. Typ. Max.
Unit
Conditions
Forward voltage
Pulsed
SP8M3
Transistors
Rev.A 3/5
P-ch
zElectrical characteristics (Ta=25°C)
Parameter Symbol
I
GSS
Y
fs
Min.
−−10 µA
Typ. Max.
Unit
Conditions
V
(BR) DSS
30 −−V
I
DSS
−−1 µA
V
GS (th)
1.0 −−2.5 V
40 56
R
DS (on)
57 80 m
65 90
3.5 −−S
C
iss
850 pF
C
oss
190
120
pF
C
rss
10
pF
t
d (on)
25
ns
t
r
60
ns
t
d (off)
25
ns
t
f
8.5
ns
Q
g
2.5
nC
Q
gs
3.0
nC
Q
gd
−−nC
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
Pulsed
V
GS
= 20V, V
DS
=0V
V
DD
15V
I
D
= −1mA, V
GS
=0V
V
DS
=−30V, V
GS
=0V
V
DS
= −10V, I
D
= −1mA
I
D
= −4.5A, V
GS
= −10V
I
D
= −2.5A, V
GS
= −4.5V
I
D
= −2.5A, V
GS
= −4.0V
I
D
= −2.5A, V
DS
= −10V
V
DS
= −10V
V
GS
=0V
f=1MHz
V
GS
= −10V
R
L
=6.0
R
G
=10
V
GS
= −5V
I
D
= −4.5A
I
D
= −2.5A, V
DD
15V
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
V
SD
−−1.2 V I
S
= −1.6A, V
GS
=0V
Parameter Symbol
Min. Typ. Max.
Unit
Conditions
Forward voltage
Pulsed

SP8M3TB

Mfr. #:
Manufacturer:
ROHM Semiconductor
Description:
MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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