Datasheet
www.rohm.com TSZ02201-0RAR1G200060-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
16/18
9.NOV.2012 Rev.001
TSZ22111･15･00
BA14741xx
●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 33.) and set the
non-inverting input terminal at the potential within input common-mode
voltage range (Vicm), for any unused circuit.
2) Input voltage
Applying VEE to VCC to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the electric
characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature characteristics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive
Output current may flow under some conditions, and heating may
destroy IC. It is necessary to connect a resistor as shown in Figure 34,
thereby protecting against load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and
VEE. Therefore, the single supply Op-Amp can be used for double supply
Op-Amp as well.
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power
dissipation (Pd) in actual operating conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts
between terminals, GND, or other components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) IC handling
When stress is applied to IC because of deflection or bend of board, the characteristics may
fluctuate due to piezo resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not
power up the board without waiting for the output capacitors to discharge. The capacitors in the low output
impedance terminal can stress the device. Pay attention to the electro static voltages during IC handling,
transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the
external capacitor, connected to output terminal, accumulated charge may be discharged VCC terminal via
the parasitic element within the circuit or terminal protection element. The element in the circuit may be
damaged (thermal destruction). When using this IC for an application circuit where there is oscillation, output
capacitor load does not occur, as when using this IC as a voltage comparator. Set the capacitor connected to
output terminal below 0.1μF in order to prevent damage to IC.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation
version only for a reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
Connect
to Vicm
protection
resistor
output short protection
Figure 34. The example of
Figure 33. The example of application
circuit for unused op-amp
VCC
VEE
Vicm
-
+
VEE
VCC
+
-
