NCP690, NCP691, NCP692, NCV8690
http://onsemi.com
15
PACKAGE DIMENSIONS
DFN6 3x3, 0.95P
CASE 506AH
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PIN 1
REFERENCE
A
B
C0.15
2X
2X
TOP VIEW
D
E
C0.15
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
3.31
0.130
0.63
0.025
2.60
0.1023
0.450
0.0177
1.700
0.685
ǒ
mm
inches
Ǔ
SCALE 10:1
0.950
0.0374
E2
BOTTOM VIEW
b
0.10
6X
L
13
0.05
C AB
C
D2
4X
e
K
64
6X
6X
(A3)
C
C0.08
6X
C0.10
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3 0.20 REF
b 0.35 0.40 0.45
D 3.00 BSC
D2 2.40 2.50 2.60
E 3.00 BSC
E2 1.50 1.60 1.70
e 0.95 BSC
K 0.21 −−− −−−
L 0.30 0.40 0.50
(NOTE 3)
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NCP690/D
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