2
Technical Data 10531
Effective April 2016
FP1010R
High frequency, high current power inductors
www.eaton.com/elx
Product Specifications
Part Number
8
OCL
1
(nH) ±15%
FLL
2
(nH)
minimum
I
rms
3
(A)
I
sat
1
4
(A)
I
sat
2
5
(A)
I
sat
3
6
(A)
DCR (mΩ)
±5% @ 20°C K-factor
7
FP1010R1-R120-R 120 84 50 94 80 75 0.185 371
FP1010R1-R150-R 150 105 50 80 68 64 0.185 371
FP1010R1-R330-R 330 230 50 30 25 23 0.185 371
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C
3. I
rms
: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating
conditions verified in the end application.
4. I
sat
1
: Peak current for approximately 20% rolloff @ +25 °C
5. I
sat
2
: Peak current for approximately 20% rolloff @ +100 °C
6. I
sat
3
: Peak current for approximately 20% rolloff @ +125 °C
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10
-3
. Bp-p:(Gauss),
K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps).
8. Part Number Definition: FP1010Rx-Rxxx-R
FP1010R= Product code and size
x= Version indicator
-Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: 1010Rx (x = Version Indicator), Rxxx = Inductance value in uH (R= decimal point)
wwllyy = date code, R = revision level
Tolerances are ±0.15 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1 millimeters
PCB tolerances are ±0.1 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
