Appendix
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www.nve.com phone: 952-829-9217 fax: 952-829-9189
ackage Drawing – PLLP6 3.0 mm x 3.0 mm P
3.10 (0.122)
3.00 (0.118)
0.98 (0.038)
0.93 (0.036)
0.45 (0.018)
0.35 (0.014)
1.55 (0.061)
1.45 (0.057)
2.30 (0.091)
2.20 (0.087)
0.45 (0.018)
0.40 (0.016)
0.12 (0.005)
0.02 (0.001)
1.00 (0.039)
0.85 (0.033)
0.05 (0.002)
0.00 (0.000)
3.10 (0.122)
3.00 (0.118)
Note: The PLLP6 package has thermal power dissipation of 320°C/Watt in free air. Attaching the package to
ote on Lead-Free Packages
orking to provide lead-free products in response to concerns about
ure tin (Sn) have already been qualified at NVE and are available in most
have higher melting
onent of NVE’s commitment to take an active part in
a circuit board improves thermal performance. Dimensions are in mm (inches).
N
The electronics industry has been w
the environmental impact of the use of lead (Pb) in solder finishes. Increasing customer demand and
directives to decrease the amounts of lead in consumer electronics products from governments around
the globe, drives this effort.
Lead-free finishes utilizing p
of our products. However, additional lead times are associated with these parts.
Since most lead-free solders being used in board assembly environments
temperatures than traditional tin-lead solders, higher reflow temperatures may be necessary to form an
equivalent solder joint between the component and the PC board. NVE characterizes all lead-free
packages using elevated temperature (245°C to 260°C) reflow profiles characteristic of lead-free board
assembly environments. All lead-free products will be identified with an “E” suffix on the part number
and a lower case “e” marking on the package.
This lead-free transition is an important comp
protecting the environment and our responsibility to our customers and the communities around the
world in which we do business. We remain dedicated to meeting our customers’ requirements and
expectations.
