Version 1.3 SFH 325 FA
2015-12-14 7
Approximate Weight:
76 mg
Recommended Solder Pad
Dimensions in mm.
2015-12-14 8
Version 1.3 SFH 325 FA
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profil-Charakteristik
Profile Feature
Ramp-up Rate to Preheat*
)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
2 3
245 250
3 4
Time
25 °C to T
P
Time within 5 °C of the specified peak
temperature T
P
- 5 K
Ramp-down Rate*
T
P
to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up Rate to Peak*
)
T
Smax
to T
P
Liquidus Temperature
Peak Temperature
Time above Liquidus temperature
Symbol
Symbol
Einheit
Unit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
Version 1.3 SFH 325 FA
2015-12-14 9
Taping
Dimensions in mm (inch).
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 330 mm reel
OHAY2273
1.5 (0.059)
4 (0.157)
2 (0.079)
8 (0.315)
4.25 (0.167)
3.95 (0.156)
5.5 (0.217)
1.75 (0.069)
12 (0.472)
Cathode/Collector Marking
D
0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D

SFH 325 FA-4-Z

Mfr. #:
Manufacturer:
OSRAM Opto Semiconductors
Description:
Phototransistors PHOTOTRANSISTOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union