ADA4897-1-EP/ADA4897-2-EP Enhanced Product
Rev. 0 | Page 8 of 12
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
Supply Voltage 11 V
Power Dissipation See Figure 3
Common-Mode Input Voltage −V
S
− 0.7 V to +V
S
+ 0.7 V
Differential Input Voltage
0.7 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −55°C to +125°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is
specified for a device soldered in a circuit board for surface-
mount packages. Table 7 lists the θ
JA
for the ADA4897-1-EP/
ADA4897-2-EP.
Table 7. Thermal Resistance
Package Type θ
JA
Unit
6-Lead Single SOT-23 (ADA4897-1-EP) 150 °C/W
10-Lead Dual MSOP (ADA4897-2-EP) 210 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4897-1-EP/
ADA4897-2-EP is limited by the associated rise in junction
temperature (T
J
) on the die. At approximately 150C, which
is the glass transition temperature, the properties of the plastic
change. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
ADA4897-1-EP/ADA4897-2-EP. Exceeding a junction temper-
ature of 175C for an extended period of time can result in
changes in silicon devices, potentially causing degradation or
loss of functionality.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the die
due to the ADA4897-1-EP/ADA4897-2-EP drive at the output.
The quiescent power dissipation is the voltage between the supply
pins (±V
S
) multiplied by the quiescent current (I
S
).
P
D
= Quiescent Power + (Total Drive Power − Load Power)
L
OUT
L
OUTS
SS
D
R
V
R
V
V
IVP
2
2
RMS output voltages should be considered. If R
L
is referenced to
−V
S
, as in single-supply operation, the total drive power is V
S
×
I
OUT
. If the rms signal levels are indeterminate, consider the worst
case, when V
OUT
= V
S
/4 for R
L
to midsupply.
L
S
SS
D
R
V
IVP
2
4/
In single-supply operation with R
L
referenced to −V
S
, worst case
is V
OUT
= V
S
/2.
Airflow increases heat dissipation, effectively reducing θ
JA
.
Also, more metal directly in contact with the package leads
and exposed paddle from metal traces, through holes, ground,
and power planes reduces θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature on a JEDEC standard
4-layer board. θ
JA
values are approximations.
0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.4
–55
–45
–35
–25
–15
–5
5
15
25
35
45
55
65
75
85
95
105
115
125
MAXIMUM POWER DISSIP
TION (W)
AMBIENT TEMPERATURE (°C)
09448-053
ADA4897-2-EP (10-LEAD MSOP)
ADA4897-1-EP (6-LEAD SOT23)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
