DS30669 Rev. 3 - 3
1 of 8
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DLP3V3DTZ
© Diodes Incorporated
NOT RECOMMENDED FOR NEW DESIGNS
DLP3V3DTZ
DUAL UNIDIRECTIONAL AND SINGLE BIDIRECTIONAL TVS
General Descriptions
• This Transient Voltage Suppressor (TVS) diode is designed for
dual unidirectional or single bidirectional protection for data
lines, components or circuits from damage due to electrostatic
discharge (ESD), cable discharge events(CDE) and lightning
(see IPPM below). It offers high ESD capability, low reverse
leakage, low junction capacitance and low clamping voltage
over range of temperature. They are suitable for computers,
communication systems, hand held portables, high density PC
boards and peripherals.
Features
• 372 Watts Peak Pulse Power (tp=8/20 μS)
• AEC-Q101 (Human Body Model- 8kV, Machine Model-400V)
and 25 kV(air)/ 8 kV(contact) as per IEC61000-4-2(ESD)
• Dual Unidirectional and Single Bidirectional Configuration
• Lead Free By Design/ROHS Compliant (Note 2)
• "Green" Device (Note 3 & 4)
• Surface Mount Package Suited for Automated Assembly
Mechanical Data
• Case: SOT-23
• Case Material: "Green” Molding Compound (Molded
Plastic). UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Fig. 1
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking & Type Code Information: See Page 6
• Ordering Information: See Page 6
• Weight: 0.008 grams (approximate)
Absolute Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Pulse Power (tp=8/20μS)
Unidirectional
P
pp
372
W
Bidirectional 145
Continuous Power Dissipation (Note1)
P
D
300 mW
Maximum Peak Pulse Current (tp=8/20 μS)
Unidirectional
I
PP
40
A
Bidirectional 15
Forward Surge Current (8.3 ms half sine-wave)
I
FSM
10.5 A
ESD per IEC 6100--4-2(air)
V
pp
± 25
kV
ESD per IEC 6100--4-2(contact)
± 8
Thermal Characteristics
Characteristic Symbol Value Unit
Operating and Storage Junction Temperature Range
T
j
, T
stg
-55 to +150
°
C
Thermal Resistance, Junction to Ambient Air (Note1)
R
θ
JA
420 °C/W
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; as per Diodes Inc. suggested pad layout document AP02001 on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Fig. 1: Schematic and Pin Configuration
D2D1 D2D1
Line1_in
N/C
GND
Line2_in Line_in GND
A. Unidirectional Protection
for two Lines
B. Bidirectional Protection
for a single Line
12
3
12
3
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