STCC05-B
5/13
Table 2: Absolute Ratings (limiting values)
Table 3: Electromagnetic Compatibility Ratings
(T
J
= 25°C, according to typical application diagram of page 1, unless otherwise specified)
Table 4: Thermal Resistance
Symbol Pin Parameter name & conditions Value Unit
V
DD
V
DD
Output supply voltage - 0.3 to 6 V
V
PS
V
PS
, IN
S
Power supply voltage, level shifter input - 0.3 to 20 V
V
SYN
SYN ZVS input voltage, R
ZV
= 15kΩ - 1 to 20 V
V
MO
BZ
1
, BZ
2
,
RL
x
, x = 1 to 4
Output voltage
- 0.3 to
V
PS
+ 0.3
V
V
I
IN
1
, IN
2
, IN
3
Input logic voltage
- 0.3 to
V
DD
+ 0.3
V
V
O
ZVS, OUT
S
, /RST
Output logic voltage
- 0.3 to
V
DD
+ 0.3
V
I
M
V
PS
Maximum sourced current pulse, tp = 10ms 500 mA
RL
x
, x = 1 to 3
Maximum sunk driver current pulse, tp = 10ms 60 mA
Maximum DC sunk current 50 mA
RL
4
Maximum sunk driver current pulse, tp = 10ms 160 mA
Maximum DC sunk current 150 mA
RL
x
, x = 1 to 4 Maximum diver diode reverse current 1 mA
I
BZ AV
BZ
1
, BZ
2
Average output current ± 2 mA
I
BZ PK
BZ
1
, BZ
2
Peak output current, tp = 50µs ± 50 mA
ΣI
M
RL
x
, l = 1 to 4
Maximum DC sunk current in all relay drivers
V
PS
= 16V, T
AMB
= 70°C, I
DD
= 50mA, DIP-20
220
mA
Maximum DC sunk current in all relay drivers
V
PS
= 16V, T
AMB
= 85°C, I
DD
= 25mA, DIP-20
300
P
DIS
All Maximum dissipation, DIP-20, T
AMB
= 70°C 0.90 W
T
AMB
AII Operating ambient temperature - 20 to 85 °C
T
J
All
Operating junction temperature - 10 to 150 °C
Storage junction temperature - 25 to 150 °C
Symbol Node Parameter name & conditions Value Unit
V
ESD
All pins ESD protection, MIL-STD 883 method 3015, HBM model ± 2
kV
V
ESD
IN
S
, SYN,
V
PS
, V
DD
ESD protection, IEC 61000-4-2, per intput, in air
(1)
± 2
ESD protection, IEC 61000-4-2, per intput, in contact
(1)
± 2
V
PPB
All pins
Total peak pulse voltage Burst, IEC 61000-4-4,
(2)
± 4
Note 1: System oriented test circuit with R
ZV
= 15kΩ, R
INS
= 2.2kΩ and C
DD
= C
PS
= 100nF
Note 2: System oriented test circuit; refer to application section
Symbol Parameter Value Unit
R
th(j-a)
DIP-20 thermal resistance junction to ambient
Single PCB with a copper thickness = 35µm and surface S
CU
= 0.5cm
2
90 °C/W