YH09T40 40A DC-DC POL Converter
5V to 13.8V Input
0.6V to 3.63V Output
Data Sheet
ZD-02095 Rev. 1.1, 18-Jun-10 www.power-one.com Page 1 of 13
Member of the Family
Applications
Low voltage, high density systems with
Intermediate Bus Architectures (IBA)
Point-of-load regulators for high performance
DSP, FPGA, ASIC, and microprocessors
Desktops, servers, and portable computing
Broadband, networking, optical, and
communications systems
Benefits
One part that covers many applications
Reduces board space, system cost and
complexity, and time to market
Features
RoHS lead free and lead-solder-exempt products are
available
High efficiency multiphase synchronous buck
topology
Low noise fixed frequency operation
Wide input voltage range: 5V–13.8V
High continuous output current: 40A
Programmable output voltage range: 0.6V–3.63V
Overcurrent, output overvoltage, and overtemperature
protections with automatic restart
Remote differential output voltage sense
Power Good signal
Enable input
Start up into prebiased load
No minimum load requirements
High MTBF of 40.5 Million hours
Industry standard size through-hole low profile
package and pinout
1.45”x1.115” (36.83mm x 28.32mm)
Low height of 0.5” (12.7mm)
Wide operating temperature range: 0 to 70ºC
UL94 V-0 flammability rating
UL60950, CSA C22.2 No. 60950-00, and TUV
EN60950-1:2001
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YH09T40-0 non-isolated DC-DC point of load (POL) converter delivers up to 40A of
output current in an industry-standard horizontal through-hole package. The YH09T40-0 POL converter is an ideal
choice for Intermediate Bus Architectures where point of load conversion is a requirement.
Operating from a 5-13.8V input the POL converter provides an extremely tightly regulated programmable output
voltage of 0.6 V to 3.63V. The POL converter offers exceptional thermal performance, even in high temperature
environments with minimal airflow. This performance is accomplished through the use of advanced circuit
solutions, packaging and processing techniques. The resulting design possesses ultra-high efficiency, excellent
thermal management, and a slim body profile that minimizes impedance to system airflow, thus enhancing cooling
for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power
electronics and thermal design, results in a product with extremely high reliability.
