EMIF06-VID01C2 Package information
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Figure 9. Flip-Chip Tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Note: More packing informations are available in the application note
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Figure 7. Footprint recommendations Figure 8. Marking
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Dot, ST logo
xx = marking
yww = date code
(y = year
ww = week)
z = manufacturing location
x
y
z
w
x
w
E
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 +/- 0.1
8 +/- 0.3
4 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
Ø 1.5 +/- 0.1
0.78 +/- 0.05
ST
xxx
yww
ST
xxx
yww
ST
xxx
yww
E
E
E
