CNY64AYST, CNY64ABST, CNY64AGRST, CNY65AYST, CNY65ABST, CNY65AGRST
www.vishay.com
Vishay Semiconductors
Rev. 1.1, 26-Jun-14
7
Document Number: 82387
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDERING GUIDLINES
Soldering Condition
The CNY64AxST, CNY65AxST are lead (Pb)-free devices.
They are suitable for reflow soldering. However due to large
package size, the peak package body temperature should
not go above 245 °C.
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent moisture absorption during transportation and
storage. Each bag contains a desiccant bag.
Floor Life
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 4, according to J-STD-020.
Drying
In case of moisture absorption devices should be baked
before soldering according to the recommended conditions
shown below
48 h at 125 °C ± 5 °C, RH < 5%
(Not suitable for tape and reel)
In case the floor time has not exceeded 10 days the units
can be baked in tape and reel according to the following
conditions
168 h at 60 °C ± 5 °C, RH < 5 %
(Not suitable, if the floor time was exceeded by more than
10 days, or the allowed factory condition is exceeded)
PACKAGE DIMENSIONS in millimeters FOR CNY64A...ST
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 120 s
max. 100 s
217 °C
max. 20 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
max. 2 cycles allowed
22550
Cathode Emitter
Anode Collector
5.08 ± 0.4
9
15.9
5.08
Recommended footprint
specications
according to DIN
technical drawings
7.2 ± 0.2
14.4 ± 0.3
12.8 ± 0.2
0.5 ± 0.2
7.05 ± 0.4
6 ± 0.2
2.9
2.1 ± 0.5
0.4 ± 0.1
Leads coplanarity
0.1 max.
Z
Z 10:1
6.544-5406.01-4
