STTH3R06
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Figure 7: Softness factor versus d
IF
/dt (typical
values)
Figure 8: Relative variations of dynamic
parameters versus junction temperature
Figure 9: Transient peak forward voltage
versus dI
F
/dt (typical values)
Figure 10: Forward recovery time versus dI
F
/dt
(typical values)
Figure 11: Junction capacitance versus
reverse voltage applied (typical values)
Figure 12: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, e
CU
=35µm) (DO-201AD)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 50 100 150 200 250 300 350 400 450 500
S factor
I=I
T =125°C
F F(AV)
j
V =400V
R
dI /dt(A/µs)
F
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 50 75 100 125
I
RM
Q
RR
S factor
T (°C)
j
I=I
Reference: T =125°C
F F(AV)
j
V =400V
R
0
2
4
6
8
10
12
14
16
18
20
0 20 40 60 80 100 120 140 160 180 200
V (V)
FP
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
t (ns)
fr
I=I
T =125°C
F F(AV)
j
V =1.1 x V max.
FR F
dI /dt(A/µs)
F
1
10
100
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0
10
20
30
40
50
60
70
80
012345678910
S (cm²)
CU
R (°C/W)
th(j-a)
DO-201AD
