Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
LVR/LVRL
Physical Characteristics
Lead material LVR005-016: Tin-plated copper, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
LVR025-040: Tin-plated copper, 0.32mm
2
(22AWG), ø0.64mm (0.025in.)
LVR055: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
LVRL: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Devices are not designed to be placed through a reflow process.
LVR/LVRL
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
BBRF
Physical Characteristics
Lead material Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method 1a, condition b, can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
BBRF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
RXEF
Physical Characteristics
Lead material RXEF005: Tin-plated nickel-copper ally, 0.128mm
2
(26AWG), ø0.40mm (0.016in.)
RXEF010: Tin-plated nickel-copper ally, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF017 to 040: Tin-plated copper-clad steel, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF050 to 090: Tin-plated copper, 0.205mm
2
(24AWG), ø0.51mm (0.020in.)
RXEF110 to 375: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1
Solder heat withstand RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 5 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RXEF
Environmental Specifications
Test Conditions Resistance Change
Passive aging -40°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±10%
Thermal Shock 85°C, -40°C (10 times) ±10%
Solvent resistance MIL-STD-202, Method 215F No change
Radial-leaded Devices
125
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Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
Cont'd
...
RTEF
Physical Characteristics
Lead material Tin-plated copper-clad steel, 0.205mm
2
(24AWG), ø0.40mm (0.016in.)
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
RTEF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
RUEF
Physical Characteristics
Lead material RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm
2
(24AWG)
RUEF300 to RUEF900: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RUEF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
RUSBF
Physical Characteristics
Lead material RUSBF075: Tin-plated nickel-copper alloy, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
Solder heat withstand RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RUSBF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
RGEF
Physical Characteristics
Lead material RGEF300 to RGEF1100: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm/0.032in.
RGEF1200 to RGEF1400: Tin-plated copper, 0.82mm
2
(18AWG), ø1.0mm/0.04in.
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
PolySwitch Resettable Devices
Radial-leaded Devices
13
126
Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
UL File # E74889
CSA File # CA78165C
TÜV Certificate number available on request (per IEC 60730-1).
Agency Recognitions for Radial-leaded Devices
Table R6 - Packaging and Marking Information for Radial-leaded Devices
Cont'd
...
Part Number Bag Quantity Tape & Reel Quantity Ammo Pack Quantity Standard Pack Quantity Part Marking Agency Recognition
LVR 240V
AC
/LVRL 120V
AC
LVR005K 500 10,000 L005 UL,CSA, TÜV
LVR005K-2 2,000 10,000 L005 UL,CSA, TÜV
LVR005S 500 10,000 L005 UL,CSA, TÜV
LVR005S-2 2,000 10,000 L005 UL,CSA, TÜV
LVR008K 500 10,000 L008 UL,CSA, TÜV
LVR008K-2 2,000 10,000 L008 UL,CSA, TÜV
LVR008S 500 10,000 L008 UL,CSA, TÜV
LVR008S-2 2,000 10,000 L008 UL,CSA, TÜV
LVR012K 500 10,000 L012 UL,CSA, TÜV
LVR012K-2 2,000 10,000 L012 UL,CSA, TÜV
LVR012S 500 10,000 L012 UL,CSA, TÜV
LVR012S-2 2,000 10,000 L012 UL,CSA, TÜV
LVR016K 500 10,000 L016 UL,CSA, TÜV
LVR016K-2 2,000 10,000 L016 UL,CSA, TÜV
LVR016S 500 10,000 L016 UL,CSA, TÜV
LVR016S-2 2,000 10,000 L016 UL,CSA, TÜV
LVR025K 500 10,000 L025 UL,CSA, TÜV
LVR025K-2 2,000 10,000 L025 UL,CSA, TÜV
LVR025S 500 10,000 L025 UL,CSA, TÜV
LVR025S-2 2,000 10,000 L025 UL,CSA, TÜV
RGEF
Environmental Specifications
Test Conditions Resistance Change
Passive aging -40°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 85°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
RHEF
Physical Characteristics
Lead material RHEF050 to RHEF200: Tin-plated copper clad steel, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
RHEF300 to RHEF1100: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm/0.032in.
RHEF1300 to RHEF1500: Tin-plated copper, 0.82mm
2
(18AWG), ø1.0mm/0.04in.
Soldering characteristics Solderability pre ANSI/J-STD-002 Category 3
Solder heat withstand per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Insulting material Cured, flame-retardant epoxy polymer; meets UL 94V-0
Devices are not designed to be placed through a reflow process.
RHEF
Environmental Specifications
Test Conditions Resistance Change
Passive aging 70°C, 1000 hours ±5%
85°C, 1000 hours ±5%
Humidity aging 85°C, 85%RH, 1000 hours ±5%
Thermal Shock 125°C, -40°C (10 times) ±5%
Solvent resistance MIL-STD-202, Method 215F No change
Devices are not designed to be placed through a reflow process.
Notes: Storage conditions: 40°Cmax., 70% RH max.; devices should remain in original sealed bags prior to use. Devices may not meet specificed values
if these storage conditions are exceeded.
For the TR devices series, see the Telecommunications and Networking section.
Radial-leaded Devices
127
13

LVR005K

Mfr. #:
Manufacturer:
Littelfuse
Description:
PTC RESET FUSE 240V 50MA RADIAL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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