PL602-04SC-R

PL602-04
Low Phase Noise CMOS XO (96MHz to 200MHz)
Micrel Inc. 2180 Fortune Dr ive San Jose, CA 95131 USA tel +1(408) 94 4 -0800 fax +1(408) 474-1000 www.micrel.com Rev 11/16/11 Page 1
FEATURES
Low phase noise XO output for the 96MHz to
200MHz range (-125 dBc at 10kHz offset).
12 to 25MHz crystal input.
Integrated crystal load capacitor: no external
load capacitor required.
Selectable High Drive (30mA) or Sta ndard Drive
(10mA) output.
3.3V operation.
Available in 8-Pin TSSOP or SOIC.
DESCRIPTION
The PL602-04 is a low cost, high performance and
low phase noise XO, providing less than -125dBc at
10kHz offset in the 96MHz to 200MHz operating
range. The very low jitter makes this chip ideal for
applications requiring clean reference frequency
sources. Input crystal can range from 12 to 25MHz
(fundamental resonant mode).
PIN CONFIGURATION
OUTPUT RANGE
MULTIPLIER
FREQUENCY
RANGE
OUTPUT
BUFFER
X8
96 - 200MHz
CMOS
BLOCK DIAGRAM
Reference
Divider
Phase
Comparator
Charge
Pump
Loop
Filter
VCO
VCO
Divider
XTAL
OSC
OE
XIN
XOUT
CLK
PL602-04
1
2
3
4 5
6
7
8
CLK
VDD
OE^
XIN
GND
N/C
XOUT
GND
Note: ^ denotes internal pull up
PL602-04
Low Phase Noise CMOS XO (96MHz to 200MHz)
Micrel Inc. 2180 Fortune Drive San Jose, CA 95131 USA tel +1(408) 944-0800 fax +1(408) 474- 1000 www.micrel.com Rev 11/16/11 Page 2
PIN DESCRIPTIONS
Name
Number
Description
CLK
1
Output clock.
VDD
2
power supply.
OE
3
Output enable input. Disables (tri-state) output when low. Internal pull-up
enables output by default if pin is not connected to low.
XIN
4
Crystal input. See Crystal Specification on page 3.
XOUT
5
Crystal output. See Crystal Specification on page 3.
N/C
6
Not connected.
GND
7, 8
Ground.
ELECTRICAL SPECIFICATIONS
1. Absolute Maximum Ratings
PARAMETERS
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage
V
DD
4.6
V
Input Voltage, dc
V
I
-0.5
V
DD
+0.5
V
Output Voltage, dc
V
O
-0.5
V
DD
+0.5
V
Storage Temperature
T
S
-65
150
C
Ambient Operating Temperature*
T
A
-40
85
C
Lead Temperature (soldering, 10s)
260
C
ESD Protection, Human Body Model
2
kV
Exposure of the device under conditions beyond the limits specif ied by Maximum Rat ings for e xtended periods may cause per manent damage to the
device and affect p roduct reliability. These co nditions represent a stress rating on ly, and functional o perations of the dev ice at these o r any other co n-
ditions above the operational limits noted in this s pecification is not i mplied.
* Not e: Operating Tempera ture is guaranteed by design for all parts (COM MERCIAL and INDU STRIAL), but tested f or COMM ERCIAL grade onl y.
2. DC Specifications
PARAMETERS
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Supply Current, Dynamic, with
Loaded Outputs
I
DD
F
XIN
= 12 - 25MHz
Output load of 10pF
35
mA
Operating Voltage
V
DD
2.97
3.63
V
Output drive current
(High Drive)
I
OH
V
OH
= V
DD
-0.4V, V
DD
=3.3V
30
mA
I
OL
V
OL
= 0.4V, V
DD
= 3.3V
30
mA
Output drive current
(Standard Drive)
I
OH
V
OH
= V
DD
-0.4V, V
DD
=3.3V
10
mA
I
OL
V
OL
= 0.4V, V
DD
= 3.3V
10
mA
PL602-04
Low Phase Noise CMOS XO (96MHz to 200MHz)
Micrel Inc. 2180 Fortune Drive San Jose, CA 95131 USA tel +1(408) 944-0800 fax +1(408) 474- 1000 www.micrel.com Rev 11/16/11 Page 3
3. AC Specifications
PARAMETERS
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Input Crystal Frequency
12
25
MHz
Output Clock Rise/Fall Time
(Standard Drive)
0.3V ~ 3.0V with 15 pF load
2.4
ns
Output Clock Rise/Fall Time
(High Drive)
0.3V ~ 3.0V with 15 pF load
1.2
Output Clock Duty Cycle
Measured @ 50% V
DD
45
50
55
%
4. Jitter and Phase Noise Specification
PARAMETERS
CONDITIONS
MIN.
TYP.
MAX.
UNITS
RMS Period Jitter
(1 sigma 1000 samples)
at 80MHz, with capacitive decoupling
between VDD and GND.
20
ps
Phase Noise relative to carrier
155.52MHz @100Hz offset
-100
dBc/Hz
Phase Noise relative to carrier
155.52MHz @1kHz offset
-115
dBc/Hz
Phase Noise relative to carrier
155.52MHz @10kHz offset
-125
dBc/Hz
Phase Noise relative to carrier
155.52MHz @100kHz offset
-116
dBc/Hz
Phase Noise relative to carrier
155.52MHz @1MHz offset
-114
dBc/Hz
Phase Noise relative to carrier
155.52MHz @10MHz offset
-132
dBc/Hz
5. Crystal Specifications
PARAMETERS
SYMBOL
MIN.
TYP.
MAX.
UNITS
Crystal Resonator Frequency
F
XIN
12
25
MHz
Crystal Loading Capacitance Rating
C
L
(xtal)
20
pF
Driving power
1
mW
ESR
R
S
30
PACKAGE INFORMATION
C
L
A
8 PIN ( dimensions in mm )
Narrow SOIC
Symbol Min.
Max
.
A 1.34 1.74
A1
0.10 0.25
B 0.33 0.51
C 0.19 0.25
D 4.80 4.95
E 3.80 4.00
H 5.80 6.20
L 0.38 1.27
e
1.27 BSC
E
H
D
A1
e
B
TSSOP
Min.
Max
.
- 1.20
0.05 0.15
0.19 0.30
0.09 0.20
2.90 3.10
4.30 4.50
6.20 6.60
0.45 0.75
0.65 BSC

PL602-04SC-R

Mfr. #:
Manufacturer:
Description:
Clock Generators & Support Products Low Phase Noise CMOS XO (96MHz to 200MHz)
Lifecycle:
New from this manufacturer.
Delivery:
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