9
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be eectively hand soldered to
PCB. However, it is only recommended under unavoid-
able circumstances such as rework. The closest manual
soldering distance of the soldering heat source (sol-
dering iron’s tip) to the body is 1.59mm. Soldering the
LED using soldering iron tip closer than 1.59mm might
damage the LED.
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in tem-
perature experienced by the board if same wave soldering setting is
used. So, it is recommended to re-calibrate the soldering prole again
before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED conguration
• ESD precaution must be properly applied on the solder-
ing station and personnel to prevent ESD damage to the
LED component that is ESD sensitive. Do refer to Avago
application note AN 1142 for details. The soldering iron
used should have grounded tip to ensure electrostatic
charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering
[1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple mounted
at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering prole to ensure that it is always conforming
to recommended soldering conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during wave
soldering should be loosely tted and should not apply
weight or force on LED. Non metal material is recom-
mended as it will absorb less heat during wave solder-
ing process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the top
side of the PCB. If surface mount need to be on the bot-
tom side, these components should be soldered using
reow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after clinch-
ing. On the other hand under sizing the PTH can cause
diculty inserting the TH LED.
CATHODE
ANODE
AlInGaP Device InGaN Device
