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DAC312HP

P1-P3P4-P6P7-P9P10-P12P13-P15
ELECTRICAL CHARACTERISTICS
DAC312E DAC312F DAC312H
Parameter Symbol Conditions Min Typ Max Min Typ Max Min Typ Max Units
Logic Input
Levels “0” V
IL
V
LC
= GND 0.8 0.8 0.8 V
Logic Input
Levels “1” V
IH
V
LC
= GND 2 2 2 V
Logic Input
Current I
IN
V
IN
= –5 V to +18 V 40 40 40 µA
Logic Input
Swing V
IS
–5 +18 –5 +18 –5 +18 V
Reference Bias
Current I
15
0 –0.5 –2 0 –0.5 –2 0 –0.5 –2 µA
Reference Input dl/dt R
14(eq)
= 800 Ω 4 8 4 8 4 8 mA/µs
Slew Rate C
C
= 0 pF (Note 1)
V+ = +13.5 V to +16.5 V, ±0.0005 ±0.001 ±0.0005 ±0.001 ±0.0005 ±0.001 %FS/%∆V
Power Supply PSSI
FS+
V– = –15 V
Sensitivity PSSI
FS–
V– = –13.5 V to –16.5 V, ±0.00025 ±0.001 ±0.00025 ±0.001 ±0.00025 ±0.001 %FS/%∆V
V+ = +15 V
Power Supply V+ 4.5 18 4.5 18 4.5 18
Range V– V
OUT
= 0 V –18 –10.8 –18 –10.8 –18 –10.8 V
I+ 3.3 7 3.3 7 3.3 7
Power Supply I– V+ = +5 V, V– = –15 V –13.9 –18 –13.9 –18 –13.9 –18
Current I+ V+ = +15 V, V– = –15 V 3.9 7 3.9 7 3.9 7 mA
I– –13.9 –18 –13.9 –18 –13.9 –18
Power V+ = +5 V, V– = –15 V 225 305 225 305 225 305
Dissipation P
d
V+ = +15 V, V– = –15 V 267 375 267 375 267 375 mW
NOTES
1
Guaranteed by design.
2
T
A
= +25°C for DAC312H grade only.
Specifications subject to change without notice.
@ V
S
= 615 V, I
REF
= 1.0 mA, 08C ≤ T
A
≤ 708C for DAC312E and –408C ≤ T
A
≤ +858C for
DAC312F, DAC312H, unless otherwise noted. Output characteristics refer to both I
OUT
and I
OUT
.
Continued
–3–
REV. C
DAC312
DAC312
–4–
REV. C
WAFER TEST LIMITS
DAC312N DAC312G
Parameter Symbol Conditions Limit Limit Units
Resolution 12 12 Bits min
Monotonicity 12 12 Bits min
Nonlinearity ±0.05 ±0.05 %FS max
Output Voltage Full-Scale Current +10 +10 V max
Compliance Voc Change <1/2 LSB –5 –5 V min
Full-Scale V
REF
= 10.000 V 4.031 4.063 mA max
Current R
14
, R
15
= 10.000 kΩ 3.967 3.935 mA min
Full-Scale Symmetry I
FSS
±1 ±2 µA max
Zero-Scale Current I
ZS
0.1 0.1 µA max
Differential DNL Deviation from ±0.012 ±0.025 %FS max
Nonlinearity Ideal Step Size ±1/2 ±1 Bits (LSB) max
Logic Input Levels “0” V
IL
V
LC
= GND 0.8 0.8 V max
Logic Input Levels “1” V
IH
V
LC
= GND 2 2 V min
Logic Input Swing V
IS
+18 +18 V max
–5 –5 V min
Reference Bias
Current I
15
–2 –2 µA max
Power Supply PSSI
FS+
V+ = +13.5 V to +16.5 V, V– = –15 V ±0.001 ±0.001
Sensitivity PSSI
FS–
V– = –13.5 V to –16.5 V, V+ = +15 V ±0.001 ±0.001 %/%max
Power Supply I+ V
S
= +15 V 7 7
Current I– I
REF
≤ 1.0 mA –18 –18 mA max
Power V
S
= +15 V
Dissipation P
D
I
REF
≤ 1.0 mA 375 375 mW max
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
@ V
S
= 615 V, I
REF
= 1.0 mA, T
A
= 258C, unless otherwise noted. Output characteristics refer to both I
OUT
and I
OUT
.
DICE CHARACTERISTICS
DIE SIZE 0.141
×
0.096 inch, 13,536 sq. mils (3.58
×
2.44 mm, 8.74 sq. mm)
1. B1 (MSB) 11. B11
2. B2 12. B12 (LSB)
3. B3 13. V
LC
/A
GND
4. B4 14. V
REF
(+)
5. B5 15. V
REF
(–)
6. B6 16. COMP
7. B7 17. V–
8. B8 18. I
O
9. B9 19. I
O
10. B10 20. V+
DAC312
–5–
REV. C
ORDERING GUIDE
1
Temperature Package Package
Model DNL Range Description Option
DAC312ER
2
±1/2 LSB 0°C to +70°C Cerdip-20 Q-20
DAC312FR ±1 LSB –40°C to +85°C Cerdip-20 Q-20
DAC312BR/883 ±1 LSB –55°C to +125°C Cerdip-20 Q-20
DAC312HP ±1 LSB –40°C to +85°C Plastic DIP-20 N-20
DAC312HS ±1 LSB –40°C to +85°C SOL-20 R-20
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.
2
For devices processed in total compliance to MIL-STD-883, add/883 after part
number. Consult factory for 883 data sheet.
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature
DAC312E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
DAC312F, DAC312H . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Storage Temperature (Tj) . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . . .300°C
Power Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V to +18 V
Analog Current Outputs . . . . . . . . . . . . . . . . . . . . –8 V to +12 V
Reference Inputs V
14
, V
15
. . . . . . . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage (V
14
, V
15
) . . . . . . . . . . ±18 V
Reference Input Current (I
14
) . . . . . . . . . . . . . . . . . . . . . 1.25 mA
Package Type u
JA
2
u
JC
Units
20-Pin Hermetic DIP (R) 76 11 °C/W
20-Pin Plastic DIP (P) 69 27 °C/W
20-Pin SOL (S) 88 25 °C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA
is specified for worst case mounting conditions, i.e., θ
JA
is specified for device
in socket for cerdip and P-DIP packages; θ
JA
is specified for device soldered to
printed circuit board for SOL package.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC312 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
P1-P3P4-P6P7-P9P10-P12P13-P15

DAC312HP

Mfr. #:
Buy DAC312HP
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC IC 12-BIT HIGH-Spd MULTIPLY
Lifecycle:
New from this manufacturer.
Delivery:
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