SAMG55 [SUMMARY DATASHEET]
Atmel-11289ES-ATARM-SAM-G55G-SAM-G55J-Summary-Datasheet_25-May-16
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4.2 64-lead QFN/LQFP Pinout
4.2.1 64-lead QFN / LQFP Pinout
Note: 1. The bottom pad of the QFN package must be tied to ground.
Table 4-3. SAM G55J19 64-pin LQFP and QFN Pinout
1 VDDIO 17 PA6 33 PA17 49 PA9
2 NRST 18 PA16 34 PA18 50 PB5
3 PB12 19 PA30 35 PA19 51 PA27
4 PA4 20 PA29 36 PA20 52 PA26
5 PA3 21 PA28 37 PB0 53 GND
6 PA0 22 PA15 38 PB1 54 PB6
7 PA1 23 PA23 39 PB2 55 PB7
8 PA5 24 PA22 40 PB3 56 PA25
9 VDDCORE 25 PA21 41 PA14 57 PB13
10 TEST 26 VDDUSB 42 PA13 58 PA24
11 PA7 27 VDDIO 43 PA12 59 PB8/XOUT
12 PA8 28 ADVREF 44 PA11 60 PB9/XIN
13 GND 29 GND 45 VDDCORE 61 PA2
14 PB15 30 VDDOUT 46 PB10 62 PB4
15 PB14 31 VDDIO 47 PB11 63 JTAGSEL
16 PA31 32 VDDIO 48 PA10 64 VDDIO
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SAMG55 [SUMMARY DATASHEET]
Atmel-11289ES-ATARM-SAM-G55G-SAM-G55J-Summary-Datasheet_25-May-16
5. Mechanical Characteristics
5.1 49-lead WLCSP Package
Figure 5-1. 49-lead WLCSP Package Mechanical Drawing
Backside coating : 0.025 min
0.040 max
SAMG55 [SUMMARY DATASHEET]
Atmel-11289ES-ATARM-SAM-G55G-SAM-G55J-Summary-Datasheet_25-May-16
12
5.2 64-lead QFN Package
Figure 5-2. 64-lead QFN Package Mechanical Drawing

ATSAMG55J19A-MU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
ARM Microcontrollers - MCU QFN, IND TEMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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