24/28
XC6221 Series
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 600
85 240
166.67
■PACKAGING INFORMATION (Continued)
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the front and 50% of the back.
The copper area is divided into four block, one block is 12.5%
of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front and
one in the back.
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit：mm)
40.0
40.0
2.54
1.4
2.5
28.9
28.9
2. Power Dissipation vs. Ambient temperature
Pd Vs. Ta
0
100
200
300
400
500
600
700
25 45 65 85 105 125
Ambient Temperature: Ta（℃）
Power Dissipation: Pd
（mW）
