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XC6221
Series
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 1000
85 400
100.00
■PACKAGING INFORMATION (Continued)
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit：mm)
2. Power Dissipation vs. Ambient temperature
Pd Vs. Ta
0
200
400
600
800
1000
1200
25 45 65 85 105 125
Ambient TemperatureTa: （℃）
Power Dissipation: Pd
（mW）
Ambient Temperature : Ta (℃)
