APTM50DUM17G

APTM50DUM17G
APTM50DUM17G – Rev 3 October, 2012
www.microsemi.com
1
7
D2
S
Q1
D1
S2
G2
Q2
G1
S1
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
See application note
APT0502 on www.microsemi.com
Symbol Parameter Max ratings Unit
V
DSS
Drain - Source Breakdown Voltage 500 V
T
c
= 25°C 180
I
D
Continuous Drain Current
T
c
= 80°C 135
I
DM
Pulsed Drain current 720
A
V
GS
Gate - Source Voltage ±30 V
R
DSon
Drain - Source ON Resistance 20
m
P
D
Maximum Power Dissipation T
c
= 25°C 1250 W
I
AR
Avalanche current (repetitive and non repetitive) 51 A
E
AR
Repetitive Avalanche Energy 50
E
AS
Single Pulse Avalanche Energy 3000
mJ
V
DSS
= 500V
R
DSon
= 17m typ @ Tj = 25°C
I
D
= 180A @ Tc = 25°C
Application
AC Switches
Switched Mode Power Supplies
Uninterruptible Power Supplies
Features
Power MOS 7
®
MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Dual common source
MOSFET Power Module
APTM50DUM17G
APTM50DUM17G – Rev 3 October, 2012
www.microsemi.com
2
7
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
GS
= 0V,V
DS
= 500V
T
j
= 25°C 400
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 400V T
j
= 125°C
2000
µA
R
DS(on)
Drain – Source on Resistance V
GS
= 10V, I
D
= 90A
17 20
m
V
GS(th)
Gate Threshold Voltage V
GS
= V
DS
, I
D
= 10mA 3 5 V
I
GSS
Gate – Source Leakage Current V
GS
= ±30 V, V
DS
= 0V ±200 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
iss
Input Capacitance 28
C
oss
Output Capacitance 5.6
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
0.36
nF
Q
g
Total gate Charge 560
Q
gs
Gate – Source Charge 160
Q
gd
Gate – Drain Charge
V
GS
= 10V
V
Bus
= 250V
I
D
= 180A
280
nC
T
d(on)
Turn-on Delay Time 21
T
r
Rise Time 38
T
d(off)
Turn-off Delay Time 75
T
f
Fall Time
Inductive switching @ 125°C
V
GS
= 15V
V
Bus
= 333V
I
D
= 180A
R
G
= 0.5
93
ns
E
on
Turn-on Switching Energy 4140
E
off
Turn-off Switching Energy
Inductive switching @ 25°C
V
GS
= 15V, V
Bus
= 333V
I
D
= 180A,
R
G
= 0.5
3380
µJ
E
on
Turn-on Switching Energy 6224
E
off
Turn-off Switching Energy
Inductive switching @ 125°C
V
GS
= 15V, V
Bus
= 333V
I
D
= 180A,
R
G
= 0.5
4052
µJ
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Tc = 25°C
180
I
S
Continuous Source current
(Body diode)
Tc = 80°C
135
A
V
SD
Diode Forward Voltage V
GS
= 0V, I
S
= - 180A 1.3 V
dv/dt Peak Diode Recovery 8 V/ns
t
rr
Reverse Recovery Time 680 ns
Q
rr
Reverse Recovery Charge
I
S
= -180A, V
R
= 333V
di
S
/dt = 400A/µs
61 µC
dv/dt numbers reflect the limitations of the circuit rather than the device itself.
I
S
- 180A di/dt 700A/µs V
R
V
DSS
T
j
150°C
APTM50DUM17G
APTM50DUM17G – Rev 3 October, 2012
www.microsemi.com
3
7
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
R
thJC
Junction to Case Thermal Resistance 0.1 °C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
4000 V
T
J
Operating junction temperature range
-40 150
T
STG
Storage Temperature Range -40 125
T
C
Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque
For terminals M5 2 3.5
N.m
Wt Package Weight 300 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTM50DUM17G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet