PARTS TOP MARK PARTS TOP MARK PARTS TOP MARK
MAX6400BS31-T AAJ
MAX6401BS31-T ABV MAX6402BS31-T ACF
MAX6400BS30-T AAI
MAX6401BS30-T ABU MAX6402BS30-T ACE
MAX6400BS29-T AAH
MAX6401BS29-T ABT MAX6402BS29-T ACD
MAX6400BS28-T AAG
MAX6401BS28-T ABS MAX6402BS28-T ACC
MAX6400BS27-T AAF
MAX6401BS27-T ABR MAX6402BS27-T ACB
MAX6400BS26-T AAE
MAX6401BS26-T ABQ MAX6402BS26-T ACA
MAX6400BS25-T AAD
MAX6401BS25-T ABP MAX6402BS25-T ABZ
MAX6400BS24-T AAC
MAX6401BS24-T ABO MAX6402BS24-T ABY
MAX6400BS23-T AAB
MAX6401BS23-T ABN MAX6402BS23-T ABX
MAX6400BS22-T AAA
MAX6401BS22-T ABM MAX6402BS22-T ABW
PARTS TOP MARK PARTS TOP MARK PARTS TOP MARK
MAX6403BS46-T ACT
MAX6404BS46-T ADH MAX6405BS46-T ADV
MAX6403BS45-T ACS
MAX6404BS45-T ADG MAX6405BS45-T ADU
MAX6403BS44-T ACR
MAX6404BS44-T ADF MAX6405BS44-T ADT
MAX6403BS43-T ACQ
MAX6404BS43-T ADE MAX6405BS43-T ADS
MAX6403BS42-T ACP
MAX6404BS42-T ADD MAX6405BS42-T ADR
MAX6403BS41-T ACO
MAX6404BS41-T ADC MAX6405BS41-T ADQ
MAX6403BS40-T ACN
MAX6404BS40-T ADB MAX6405BS40-T ADP
MAX6403BS39-T ACM
MAX6404BS39-T ADA MAX6405BS39-T ADO
MAX6403BS38-T ACL
MAX6404BS38-T ACZ MAX6405BS38-T ADN
MAX6403BS37-T ACK
MAX6404BS37-T ACY MAX6405BS37-T ADM
MAX6403BS36-T ACJ
MAX6404BS36-T ACX MAX6405BS36-T ADL
MAX6403BS35-T ACI
MAX6404BS35-T ACW MAX6405BS35-T ADK
MAX6403BS34-T ACH
MAX6404BS34-T ACV MAX6405BS34-T ADJ
MAX6403BS33-T ACG
MAX6404BS33-T ACU MAX6405BS33-T ADI
Table 2. Device Marking Codes
MAX6400–MAX6405
µP Supervisory Circuits in 4-Bump (2 ✕ 2)
Chip-Scale Package
8 _______________________________________________________________________________________
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user’s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note, which can be found on Maxim’s website at
www.maxim-ic.com.