IRF3007STRLPBF

HEXFET
®
Power MOSFET
This design of HEXFET
®
Power MOSFETs utilizes
the lastest processing techniques to achieve extremely
low on-resistance per silicon area. Additional features
of this HEXFET power MOSFET are a 175°C junction
operating temperature, fast switching speed and
improved repetitive avalanche rating. These combine
to make this design an extremely efficient and reliable
device for use in a wide variety of applications.
S
D
G
V
DSS
= 75V
R
DS(on)
= 0.0126
I
D
= 62A
Description
07/23/10
www.irf.com 1
IRF3007SPbF
IRF3007LPbF
TO-262
IRF3007LPbF
D
2
Pak
IRF3007SPbF
** This is applied to D
2
Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 62
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 44 A
I
DM
Pulsed Drain Current 320
P
D
@T
C
= 25°C Power Dissipation 120 W
Linear Derating Factor 0.8 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 290 mJ
E
AS
(6 sigma) Single Pulse Avalanche Energy Tested Value 946
I
AR
Avalanche Current See Fig.12a, 12b, 15, 16 A
E
AR
Repetitive Avalanche Energy mJ
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
θJC
Junction-to-Case –– 1.25 °C/W
R
θJA
Junction-to-Ambient (PCB Mounted,steady state)** ––– 62
Thermal Resistance
Typical Applications
l Industrial Motor Drive
Features
l Ultra Low On-Resistance
l 175°C Operating Temperature
l Fast Switching
l Repetitive Avalanche Allowed up to Tjmax
l Lead-Free
PD - 95494A
IRF3007S/LPbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 75 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.084 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– 10.5 12.6 m V
GS
= 10V, I
D
= 48A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= 10V, I
D
= 250µA
g
fs
Forward Transconductance 180 ––– ––– S V
DS
= 25V, I
D
= 48A
––– ––– 20
µA
V
DS
= 75V, V
GS
= 0V
––– ––– 250 V
DS
= 60V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 200 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -200
nA
V
GS
= -20V
Q
g
Total Gate Charge –– 89 130 I
D
= 48A
Q
gs
Gate-to-Source Charge ––– 21 32 nC V
DS
= 60V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 30 45 V
GS
= 10V
t
d(on)
Turn-On Delay Time ––– 12 ––– V
DD
= 38V
t
r
Rise Time ––– 80 ––– I
D
= 48A
t
d(off)
Turn-Off Delay Time ––– 55 ––– R
G
= 4.6
t
f
Fall Time ––– 49 ––– V
GS
= 10V
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 3270 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 520 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance –– 78 ––– ƒ = 1.0MHz, See Fig. 5
C
oss
Output Capacitance ––– 3500 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 340 ––– V
GS
= 0V, V
DS
= 60V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 640 ––– V
GS
= 0V, V
DS
= 0V to 60V
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage –– –– 1.3 V T
J
= 25°C, I
S
= 48A, V
GS
= 0V
t
rr
Reverse Recovery Time –– 85 130 ns T
J
= 25°C, I
F
= 48A, V
DD
= 38V
Q
rr
Reverse Recovery Charge ––– 280 420 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
80
320
A
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
Starting T
J
= 25°C, L = 0.24mH
R
G
= 25, I
AS
= 48A, V
GS
=10V (See Figure 12).
I
SD
48A, di/dt 330A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 400µs; duty cycle 2%.
Notes:
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
Limited by T
Jmax
, see Fig.12a, 12b, 15, 16 for typical repetitive
avalanche performance.
This value determined from sample failure population. 100%
tested to this value in production.
IRF3007S/LPbF
www.irf.com 3
Fig 4. Typical Forward Transconductance
Vs. Drain Current
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0. 1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.5V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
0. 1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.5V
20µs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
4.0 5.0 6.0 7.0 8.0 9.0
V
GS
, Gate-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 25V
20µs PULSE WIDTH
0 40 80 120 160
I
D,
Drain-to-Source Current (A)
0
20
40
60
80
100
G
f
s
,
F
o
r
w
a
r
d
T
r
a
n
s
c
o
n
d
u
c
t
a
n
c
e
(
S
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 25V
20µs PULSE WIDTH

IRF3007STRLPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFET 75V D2PAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet