ATPL360-EK

Summary
ATPL360 is a multi-protocol modem for Power Line Communication (PLC). It implements a very exible architecture, which allows
support for standard and customized PLC solutions. This compact and highly ecient device is ideal for a wide range of smart grid
applications such as smart metering, lighting, industrial/home automation, home and building energy management systems, solar
energy and Plug-in Hybrid Electric Vehicle (PHEV) charging stations.
The ATPL360 has to be bundled with an external microcontroller (MCU), which controls the ATPL360 PLC modem and downloads
the corresponding PLC PHY layer binary before modem operation. The ATPL360 PLC binary is stored in SRAM.
Microchip provides highly ecient, reduced BOM reference designs for dierent coupling options, targeting common congura-
tions in standard frequency bands which comply with existing regulations (CENELEC, FCC, ARIB).
www.microchip.com/smartenergy
Smart Energy
ATPL360
Multi-Protocol Modem for Power Line Communication
Key Features
Multi-protocol PLC modem
• G3-PLC, all proles (CENELEC, FCC, ARIB) and modes
• PRIME PLC, all proles (PRIME 1.3, PRIME1.4)
• IEEE P1901.2
• Congurable PLC modem able to implement any
NB-PLC standard
96 KB (up to) 128 KB of SRAM for Program
64 KB (up to) 96 KB of SRAM for Data
One SPI peripheral to external MCU
Zero-Crossing Detection (ZCD)
Embedded PLC Analog Front End (AFE), requires only external
discrete Class D Line Driver for signal injection
Low power consumption in transmission and reception
Temperature range: −40ºC to +85ºC
Package
• 48-pin QFN
• 48-pin TQFP
Target Applications
Smart metering
Street lighting
Home and building energy management systems
Solar energy
Plug-in hybrid electric vehicle charging stations
Industrial and home automation
PL360
Customer Application
G3-PLC PRIME-PLC
ATPL360 Host Component
SPI
MCU Host
SAPI
PHY
The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective
companies. © 2017, Microchip Technology Incorporated. All Rights Reserved. 8/17
DS00002296B
www.microchip.com/smartenergy
ATPL360 Evaluation Kit (ATPL360-EK)
Microchip’s ATPL360 Evaluation Kit is a hardware platform for evaluating the ATPL360 multi-protocol modem for power line
communication. The kit will provide easy access to the features of the ATPL360, and will include a ATSAM4CMS System-on-Chip
with embedded metrology. This kit makes it easy to evaluate Microchip’s platform concept for smart energy applications. The kit
includes:
Two ATPL360MB modem boards
• Two coupling boards to congure the evaluation kit for frequencies below 100 kHz (CENELEC profile)
• Two coupling boards to congure the evaluation kit for frequencies above 150 kHz (FCC and ARIB profiles)
Documentation for PLC hardware design
• Schematics, PCB layout, gerbers and BOM
• ATPL360 datasheet
• Application notes for PLC hardware design
PLC software (G3-PLC and PRIME)
• Examples showing how to use and congure the PHY layer on the ATPL360
• Complete G3-PLC and PRIME software stack to implement an end device
• PAN coordinator/base node “lite” example application
• Software documentation
Microchip tools for PLC developers: PC applications to evaluate the performance of the ATPL360 and network level
(PHY tester, Multi-protocol sniffer)
For more information, please email PLC@microchip.com.

ATPL360-EK

Mfr. #:
Manufacturer:
Description:
EVK FOR ATPL360
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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