FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 13
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
NOTES:
1. DIE THICKNESS IS 0.100 [0.004], BACKSIDE IS GROUND
2. BOND PADS ARE 0.100 [0.004] SQUARE
3. BOND PAD SPACING, CTR-CTR: 0.150 [0.006]
4. ALL DIMENSION IN INCHES [MILLIMETERS]
5. ALL TOLERANCES ARE ±0.025 [±0.001]
6. BOND PAD METALLIZATION: GOLD
7. BACKSIDE METALLIZATION: GOLD
Input Drive +27 dBm
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information
[1]
Standard Alternate
WP-2 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
