BelaSigna R281
www.onsemi.com
11
PACKAGE DIMENSIONS
CASE 567NB
ISSUE A
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
DIM
A
MIN NOM
−−−
MILLIMETERS
A1
D
E
b 0.20 0.225
e 0.40 BSC
−−−
E
D
A B
PIN A1
REFERENCE
e1
A0.03 BC
0.15
C
0.05 C
31X
b
4
E
C
A
0.08 C
A1
C
0.17 0.20
0.20
31X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.52
0.40
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
RECOMMENDED
PACKAGE
OUTLINE
123
PITCH
G
I
PITCH
A1
K
M
5
A2
e1 0.52 BSC
0.405 REF
A2
F
D
B
H
J
L
e/2
0.20
DETAIL A
A
DETAIL A
A3
A3 0.025 REF
2.74 2.77
2.42 2.45
MAX
0.25
0.635
0.23
2.80
2.48
R281/D
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