IRF1902PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.2 V T
J
= 25°C, I
S
= 2.5A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 38 57 ns T
J
= 25°C, I
F
= 2.5A
Q
rr
Reverse Recovery Charge ––– 42 63 nC di/dt = 100A/µs
Source-Drain Ratings and Characteristics
A
17
4.2
Repetitive rating; pulse width limited by
max. junction temperature.
Notes:
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Surface mounted on 1 in square Cu board
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 20 ––– ––– V V
GS
= 0V, I
D
= 250µA
∆V
(BR)DSS
/∆T
J
Breakdown Voltage Temp. Coefficient ––– 0.019 ––– V/°C Reference to 25°C, I
D
= 1mA
––– ––– 85 V
GS
= 4.5V, I
D
= 4.0A
––– ––– 170 V
GS
= 2.7V, I
D
= 3.2A
V
GS(th)
Gate Threshold Voltage 0.70 ––– ––– V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 5.6 ––– ––– S V
DS
= 10V, I
D
= 4.0A
––– ––– 1.0 V
DS
= 16V, V
GS
= 0V
––– ––– 25 V
DS
= 16V, V
GS
= 0V, T
J
= 70°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 12V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -12V
Q
g
Total Gate Charge ––– 5.0 7.5 I
D
= 4.2A
Q
gs
Gate-to-Source Charge ––– 1.2 ––– nC V
DS
= 10V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 1.8 ––– V
GS
= 4.5V
t
d(on)
Turn-On Delay Time ––– 5.9 ––– V
DD
= 10V
t
r
Rise Time ––– 13 ––– I
D
= 1.0A
t
d(off)
Turn-Off Delay Time ––– 23 ––– R
G
= 53Ω
t
f
Fall Time ––– 19 ––– V
GS
= 4.5V
C
iss
Input Capacitance ––– 310 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 130 ––– pF V
DS
= 15V
C
rss
Reverse Transfer Capacitance ––– 55 ––– ƒ = 1.0MHz
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
µA
mΩ
R
DS(on)
Static Drain-to-Source On-Resistance
I
DSS
Drain-to-Source Leakage Current
nA
ns
