OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

CP647-2N6287-CM

P1-P3P4-P4
CP647-2N6287
PNP - Darlington Transistor Die
20 Amp, 100 Volt
MECHANICAL SPECIFICATIONS:
Die Size 211 x 211 MILS
Die Thickness 12.5 MILS
Base Bonding Pad Size 49 x 41 MILS
Emitter Bonding Pad Size 60 x 50 MILS
Top Side Metalization Al – 50,000Å
Back Side Metalization Ti/Ni/Ag – 1,000Å/6,000Å/10,000Å
Scribe Alley Width 4 MILS
Wafer Diameter 4 INCHES
Gross Die Per Wafer 246
R0 (13-June 2016)
The CP647-2N6287 die is a silicon PNP Darlington power transistor designed for high current
applications.
MAXIMUM RATINGS: (T
A
=25°C) SYMBOL UNITS
Collector-Base Voltage V
CBO
100 V
Collector-Emitter Voltage V
CEO
100 V
Emitter-Base Voltage V
EBO
5.0 V
Continuous Collector Current I
C
20 A
Peak Collector Current I
CM
40 A
Continuous Base Current I
B
0.5 A
Operating and Storage Junction Temperature T
J
, T
stg
-65 to +150 °C
ELECTRICAL CHARACTERISTICS: (T
C
=25°C unless otherwise noted)
SYMBOL TEST CONDITIONS MIN MAX UNITS
I
CEX
V
CE
=100V, V
EB
=1.5V 0.5 mA
I
CEO
V
CE
=50V 1.0 mA
I
EBO
V
EB
=5.0V 2.0 mA
BV
CEO
I
C
=100mA 100 V
V
CE(SAT)
I
C
=10A, I
B
=40mA 2.0 V
V
CE(SAT)
I
C
=20A, I
B
=200mA 3.0 V
V
BE(SAT)
I
C
=20A, I
B
=200mA 4.0 V
V
BE(ON)
V
CE
=3.0V, I
C
=10A 2.8 V
h
FE
V
CE
=3.0V, I
C
=10A 750 18K
h
FE
V
CE
=3.0V, I
C
=20A 100
h
fe
V
CE
=3.0V, I
C
=10A, f=1.0kHz 300
f
T
V
CE
=3.0V, I
C
=10A, f=1.0MHz 4.0 MHz
C
ob
V
CB
=10V, I
E
=0, f=100kHz 600 pF
www.centralsemi.com
CP647-2N6287
Typical Electrical Characteristics
R0 (13-June 2016)
www.centralsemi.com
BARE DIE PACKING OPTIONS
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
R2 (3-April 2017)
www.centralsemi.com
P1-P3P4-P4

CP647-2N6287-CM

Mfr. #:
Buy CP647-2N6287-CM
Manufacturer:
Central Semiconductor
Description:
TRANS PNP DARL 20A 100V DIE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet