25
LTC3732
3732f
The output ripple current is reduced significantly when
compared to the single phase solution using the same
inductance value because the V
OUT
/L discharge currents
term from the stages that has their bottom MOSFETs on
subtract current from the (V
CC
– V
OUT
)/L charging current
resulting from the stage which has its top MOSFET on. The
output ripple current for a 3-phase design is:
I
P-P
=
()()
()
>
V
fL
DC V V
OUT
IN OUT
13 3
The ripple frequency is also increased by three, further
reducing the required output capacitance when V
CC
< 3V
OUT
as illustrated in Figure 6.
The addition of more phases by phase locking additional
controllers, always results in no net input or output ripple
at V
OUT
/V
IN
ratios equal to the number of stages
implemented. Designing a system with multiple stages
close to the V
OUT
/V
IN
ratio will significantly reduce the
ripple voltage at the input and outputs and thereby
improve efficiency, physical size and heat generation of
the overall switching power supply. Refer to Application
Note 77 for more information on Polyphase circuits.
Efficiency Calculation
To estimate efficiency, the DC loss terms include the input
and output capacitor ESR, each MOSFET R
DS(ON)
, induc-
tor resistance R
L
, the sense resistance R
SENSE
and the
forward drop of the Schottky rectifier at the operating
output current and temperature. Typical values for the
design example given previously in this data sheet are:
Main MOSFET R
DS(ON)
= 7m (9m at 90°C)
Sync MOSFET R
DS(ON)
= 7m (9m at 90°C)
C
INESR
= 20m
C
OUTESR
= 3m
R
L
= 2.5m
R
SENSE
= 3m
V
SCHOTTKY
= 0.8V at 15A (0.7V at 90°C)
V
OUT
= 1.3V
V
IN
= 12V
I
MAX
= 45A
δ = 0.01%°C (MOSFET temperature coefficient)
N = 3
f = 400kHz
The main MOSFET is on for the duty factor V
OUT
/V
IN
and
the synchronous MOSFET is on for the rest of the period
or simply (1 – V
OUT
/V
IN
). Assuming the ripple current is
small, the AC loss in the inductor can be made small if a
good quality inductor is chosen. The average current,
I
OUT
is used to simplify the calaculations. The equation
below is not exact but should provide a good technique
for the comparison of selected components and give a
result that is within 10% to 20% of the final application.
The temperature of the MOSFET’s die temperature may
require interative calculations if one is not familiar typical
performance. A maximum operating junction tempera-
ture of 90° to 100°C for the MOSFETs is recommended
for high reliability applications.
Common output path DC loss:
PN
I
N
RR
C Loss
COMPATH
MAX
L SENSE
OUTESR
+
()
+
2
This totals 3.7W + C
OUTESR
loss.
Total of all three main MOSFET’s DC loss:
PN
V
V
I
N
R
C Loss
MAIN
OUT
IN
MAX
DS ON
INESR
=
+
()
+
2
1 δ
()
This totals 0.66W + C
INESR
loss.
Total of all three synchronous MOSFET’s DC loss:
PN
V
V
I
N
R
SYNC
OUT
IN
MAX
DS ON
=
+
()
11
2
()
δ
This totals 5.4W.
APPLICATIO S I FOR ATIO
WUUU
26
LTC3732
3732f
APPLICATIO S I FOR ATIO
WUUU
Total of all three main MOSFET’s AC loss:
PV
A
pF
VV V
kHz W
MAIN IN
≈Ω
+
=
3
45
23
2 1000
1
518
1
18
400 6 3
2
()
()()
()( )
–. .
().
This totals 1W at V
IN
= 8V, 2.25W at V
IN
= 12V and 6.25W
at V
IN
= 20V.
Total of all three synchronous MOSFET’s AC loss:
() () ()( ) ( )361545Q
V
V
fnC
V
V
E
G
IN
DSSPEC
IN
DSSPEC
=
This totals 0.08W at V
IN
= 8V, 0.12W at V
IN
= 12V and
0.19W at V
IN
= 20V. The bottom MOSFET does not
experience the Miller capacitance dissipation issue that
the main switch does because the bottom switch turns on
when its drain is close to ground.
The Schottky rectifier loss assuming 50ns nonoverlap
time:
2 • 3(0.7V)(15A)(50ns)(4E5)
This totals 1.26W.
The total output power is (1.3V)(45A) = 58.5W and the
total input power is approximately 70W so the % loss of
each component is as follows:
Main switch AC loss (V
IN
= 12V) 2.25W 3.75%
Main switch DC loss 0.66W 1.1%
Synchronous switch AC loss 0.19W 0.3%
Synchronous switch DC loss 5.4W 9%
Power path loss 3.7W 6.1%
The numbers above represent the values at V
IN
= 12V. It
can be seen from this simple example that two things can
be done to improve efficiency: 1) Use two MOSFETs on the
synchronous side and 2) use a smaller MOSFET for the
main switch with smaller C
MILLER
to better balance the AC
loss with the DC loss. A smaller, less expensive MOSFET
can actually perform better in the task of the main switch.
U
PACKAGE DESCRIPTIO
G Package
36-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
G36 SSOP 0802
0.09 – 0.25
(.0035 – .010)
0
° – 8°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
7.40 – 8.20
(.291 – .323)
1234
5
6
7
8 9 10 11 12 14 15 16 17 1813
12.50 – 13.10*
(.492 – .516)
2526 22 21 20 19232427282930313233343536
2.0
(.079)
0.05
(.002)
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42 ±0.03 0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25 ±0.12
27
LTC3732
3732f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
0.40 ± 0.10
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.15 ± 0.10
(2 SIDES)
7.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
(UH) QFN 0303
0.50 BSC
0.200 REF
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
3.15 ± 0.10
(2 SIDES)
0.18
0.18
0.23
0.435
0.00 – 0.05
0.75 ± 0.05
0.70 ± 0.05
0.50 BSC
5.20 ± 0.05 (2 SIDES)
3.20 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
5.50 ± 0.05
(2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
0.25 ± 0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)

LTC3732CUHF#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3-Phase, 5-Bit VID, 600kHz Synch Buck Swiching Controller
Lifecycle:
New from this manufacturer.
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