DOCUMENT NUMBER
DOC TYPE
DOC PART
5050661000
PSD
001
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL ±
1.0
°
SERIES
MATERIAL NUMBER
CUSTOMER
GENERAL
505066
SEE CHART
4 PLACES
±
0.001
3 PLACES
±
0.003
2 PLACES
±
0.03
1 PLACE
±
0.1
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
DIMENSION UNITS SCALE
MM
20:1
DRWN BY DATE
TSOMEYA
2016/06/21
CHK'D BY
DATE
KTANAKA03 2016/12/01
APPR BY DATE
TKUSUHARA01
2016/12/01
DRAWING SIZE
THIRD ANGLE PROJECTION
A3
0.35 BB CONN. H=0.6 SSB6 RP REC ASSY
PRODUCT CUSTOMER DRAWING
REVISED
2016/12/06
2016/12/06
2016/12/06
111141
TSOMEYA
TASAKAWA
TKUSUHARA01
EC NO:
DRWN:
CHK'D:
APPR:
B
REV
SHEET NUMBER
1 OF 2
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
FORMAT: tb-prod-A3
REVISION: G
DATE: 2015/12/14
RELEASE STATUS
P1
RELEASE DATE
06.12.2016 09:16:40
11.90
14.70
505066-7020
--- ---
70
10.85
13.65
505066-6420
--- ---
64
10.15
12.95
505066-6020
--- ---
60
9.80
12.60
505066-5820
--- ---
58
9.10
11.90
505066-5420
○
---
54
8.40
11.20
505066-5020
○
---
50
8.05
10.85
505066-4820
○
---
48
7.70
10.50
505066-4620
--- ---
46
7.00
9.80
505066-4220
○
---
42
6.65
9.45
505066-4020
○
---
40
6.30
9.10
505066-3820
--- ---
38
5.60
8.40
505066-3420
○
---
34
4.90
7.70
505066-3020
○
---
30
3.85
6.65
505066-2420
○
---
24
3.50
6.30
505066-2220
○
---
22
3.15
5.95
505066-2020
○
---
20
2.80
5.60
505066-1820
--- ---
18
2.45
5.25
505066-1620
○
---
16
2.10
4.90
505066-1420
○
---
14
1.75
4.55
505066-1220
○
---
12
1.40
4.20
505066-1020
○
---
10
1.05
3.85
505066-0820
---
○
8
0.70
3.50
505066-0620
○
---
6
B A
EMBOSSED TAPE PACKAGE
HIGH VOL.
TOOL
LOW VOL.
TOOL
CIRCUIT
ORDER NO.
SAMPLE PREPARATION
○ :TOOLED
△ :WORK IN PROCESS
--- :TOOLING TO BE CONFIRMED
CONNECTOR SERIES No. : 505066-**09
1
MATERIAL
WAFER:LIQUID CRYSTAL POLYMER UL94V-0(COLOR :BLACK)
TERMINAL:COPPER ALLOY
FITTING NAIL : COPPER ALOY
2
PLATING
TERMINAL :
CONTACT AREA: SEPARATED GOLD PLATING
(0.1 MICROMETER MINIMUM).
SOLDER TAIL AREA: SEPARATED GOLD PLATING.
UNDERPLATE: NICKEL OVERALL.
*DIVIDE INTO PARTS THE GOLD PLATING OF THE CONTACT
AND THE TAIL PART BY THE NICKEL PLATING.
FITTING NAIL :
CONTACT AREA: SEPARATED GOLD PLATING
(0.1 MICROMETER MINIMUM).
SOLDER TAIL AREA: SEPARATED GOLD PLATING.
UNDERPLATE: NICKEL OVERALL.
*DIVIDE INTO PARTS THE GOLD PALATING OF THE CONTACT
AND THE TAIL PART BY THE NICKEL PLATING.
*EVEN THOUGH GOLD PLATING ON THE TOP SURFACE OF NAIL
MIGHT BE THIN, NO FUNCTIONAL PROBLEM.
APPLY FOR (CIRCUIT/2)=EVEN.
4
MATE WITH : 505070-**10/505070-**20
5
TAIL AND FITTING NAIL COPLANARITY TO BE 0.08MAXIMUM.
PROHIITED AREA OF PATTERN WIRING AND SOLDER.
(FOR EACH AREA, THE WIRING THAT TOUCHES ON THE SOLDER
CAN BE ATTACHED, THEN COVERED WITH A FILMTO KEEP SOLDER OUT).
7
ELV and RoHS COMPLIANT.
NOTES
A
B
0.35
0.175
0.68
±
0.1
2
±
0.2
B( )
1.16
±
0.1
1.16
±
0.1
0.22
±
0.05
0.1
±
0.03
0.965
±
0.05
0.225
±
0.03
0.58
±
0.05
X
⌖ 0.15 X
(PITCH)
(PICK-UP AREA)
(FITTING NAIL WIDTH)
(TERMINAL WIDTH)
FITTING NAIL
TERMINAL
HOUSING
L
C
L
C
L
C
6
3
3
