Package mechanical data M95160-x, M95080-x
42/50 Doc ID 8028 Rev 9
Figure 19. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, package outline
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is internally pulled to V
SS
. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 29. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.55 0.45 0.6 0.0217 0.0177 0.0236
A1 0.02 0 0.05 0.0008 0 0.002
b 0.25 0.2 0.3 0.0098 0.0079 0.0118
D 2 1.9 2.1 0.0787 0.0748 0.0827
D2 1.6 1.5 1.7 0.063 0.0591 0.0669
E 3 2.9 3.1 0.1181 0.1142 0.122
E2 0.2 0.1 0.3 0.0079 0.0039 0.0118
e 0.5 - - 0.0197 - -
L 0.45 0.4 0.5 0.0177 0.0157 0.0197
L1 0.15 0.0059
L3 0.3 0.0118
ddd
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.08 0.08
D
E
UFDFPN-01
A
A1
ddd
L1
e
b
D2
L
E2
L3
