LQH55DN100M03L

SpecNo.JELF243A-0045R-01 P1/8
MURATA MFG.CO., LTD
Reference Only
CHIP COILCHIP INDUCTORSLQH55DN□□□□03L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH55DN Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ H 55 D N R12 M 0 3 L
Product ID
Structure Dimension
Applications Category Inductance Tolerance Features
Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
Operating Temperature Range -40 to +80°C
Storage Temperature Range -40 to +85°C
Customer
Part Number
MURATA
Part Number
Inductance
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
Rated
Current
(A)
(μH)
Tolerance
(%)
LQH55DNR12M03L 0.12
±20
0.007±40% 450 6.0
LQH55DNR27M03L 0.27 0.010±40% 300 5.3
LQH55DNR47M03L 0.47 0.013±40% 200 4.8
LQH55DN1R0M03L 1.0 0.019±40% 150 4.0
LQH55DN1R5M03L 1.5 0.022±40% 110 3.7
LQH55DN2R2M03L 2.2 0.029±40% 80 3.2
LQH55DN3R3M03L 3.3 0.036±40% 40 2.9
LQH55DN4R7M03L 4.7 0.041±40% 30 2.7
LQH55DN6R8M03L 6.8 0.074±40% 25 2.0
LQH55DN100M03L 10 0.093±40% 20 1.7
LQH55DN150M03L 15 0.15 ±40% 17 1.4
LQH55DN220M03L 22 0.19 ±40% 15 1.2
LQH55DN330M03L 33 0.32 ±40% 12 0.9
LQH55DN470M03L 47 0.40 ±40% 10 0.8
LQH55DN680M03L 68 0.67 ±40% 7.6 0.64
LQH55DN101M03L 100 0.86 ±40% 6.5 0.56
LQH55DN151M03L 150 1.9 ±40% 5.0 0.42
LQH55DN221M03L 220 2.4 ±40% 4.0 0.32
LQH55DN331M03L 330 4.4 ±40% 3.1 0.27
LQH55DN471M03L 470 5.4 ±40% 2.4 0.24
LQH55DN681M03L 680 8.1 ±40% 1.9 0.19
LQH55DN102M03L 1000 10.3 ±40% 1.7 0.15
LQH55DN222M03L 2200 21.5 ±40% 1.2 0.10
LQH55DN472M03L 4700 43.6 ±40% 0.8 0.07
LQH55DN103M03L 10000 100 ±40% 0.5 0.05
When applied Rated current to the Products , self temperature rise shall be limited to 40 max and Inductance
will be within ±40% of initial Inductance value.
4.Testing Conditions
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C
Humidity : Ordinary Humidity (25 to 85 % (RH)) Humidity : 60 to 70 %
(RH)
Atmospheric Pressure : 86 to 106 kPa
SpecNo.JELF243A-0045R-01 P2/8
MURATA MFG.CO., LTD
Reference Only
5.Appearance and Dimensions
Unit Mass (Typical value)
0.48g
(in mm)
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3. Measuring Equipment :
KEYSIGHT 4194A or equivalent
Measuring Frequency :
1 MHz / 0.12μH to 68μH
100 kHz / 100μH to 680μH
10 kHz / 1000μH to 10000μH
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter
6.3 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment :
f < 1 MHz : KEYSIGHT 4194A or equivalent
f 1 MHz : KEYSIGHT E4991A or equivalent
6.4 Rated Current Self temperature rise shall be limited
to 40°C max.
Inductance Change : within ± 40%
The rated current is applied.
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged. Substrate : Glass-epoxy substrate
Applied Direction :
Force : 10N
Hold Duration : 5±1 s
7.2 Bending Test Chip coil shall not be damaged. Substrate : Glass-epoxy substrate
(100 × 40 × 1.6mm)
Speed of Applying Force : 1mm / s
Deflection : 2mm
Hold Duration : 30 s
(in mm)
5.0±0.3
5.7±0.3
1.3min.1.3min. 1.7min.
5.0±0.3
4.0.3
No marking.
F
Substrate
Chip Coil
45
R340
F
Deflection
45
Product
Pressure jig
SpecNo.JELF243A-0045R-01 P3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.3 Vibration Chip coil shall not be damaged. Oscillation Frequency :
10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time :
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4 Solderability The wetting area of the electrode hall
be at least 90% covered with new
solder coating.
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 240±5°C
Immersion Time : 3±1 s
7.5 Resistance to
Soldering Heat
Appearance : No damage
Inductance Change : within ± 5%
Flux : Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150±10°C / 60 to 90seconds
Solder Temperature : 270±5°C
Immersion Time : 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance : No damage
Inductance Change : within ± 5 %
Rdc Change : within ± 5 %
Temperature : 85±2°C
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.2 Cold Resistance Temperature : -40±2°C
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.3 Humidity Temperature : 40±2°C
Humidity : 90 to 95%(RH)
Time : 1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle :
step 1 : -40±2°C / 30±3 min
step 2 : Ordinary temp. / 10 to 15 min
step 3 : +85±2°C / 30±3 min
step 4 : Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.

LQH55DN100M03L

Mfr. #:
Manufacturer:
Description:
Fixed Inductors 10uH 20%
Lifecycle:
New from this manufacturer.
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