Design, Specifications are subject to change without notice. Contact your nearest Panasonic sales office for the latest specifications prior to purchase and / or use.
Whenever any doubt about safety comes up with this product, please contact us immediately for engineering assistance without fail.
Specifications are typical and may not apply to all applications.
Engineering Draft
CE-VFK-CE-22
Application Guidelines
21
1. Circuit Design
1.1 Operating Temperature and Frequency
Electrical parameters for electrolytic capacitors are normally specified at 20 temperature and 120 Hz frequency.
These parameters vary with changes in temperature and frequency. Circuit designers should take these changes into consideration.
(1) Effects of operating temperature on electrical parameters
a) At higher temperatures, leakage current and capacitance increase while equivalent series resistance (ESR) decreases.
b) At lower temperatures, leakage current and capacitance decrease while equivalent series resistance (ESR) increases.
(2) Effects of frequency on electrical parameters
a) At higher frequencies, capacitance and impedance decrease while tanδ increases.
b) At lower frequencies, heat generated by ripple current will rise due to an increase in equivalent series resistance (ESR).
1.2 Operating Temperature and Life Expectancy
(1) Expected life is affected by operating temperature. Generally, each 10 reduction in temperature will double the expected life.
Use capacitors at the lowest possible temperature below the upper category temperature.
(2) If operating temperatures exceed the upper category limit, rapid deterioration of electrical parameter will occur and irreversible damage
will result.
Check for the maximum capacitor operating temperatures including ambient temperature, internal capacitor temperature rise due to
ripple current, and the effects of radiated heat from power transistors, IC's or resistors.
Avoid placing components, which could conduct heat to the capacitor from the back side of the circuit board.
(3) The formula for calculating expected life at lower operating temperatures is as follows ;
10
ーT
×=
L
1
: Guaranteed life (h) at temperature, T
1
L
2
: Expected life (h) at temperature, T
2
T
1
: Upper category temperature ()
T
2
: Actual operating temperature, ambient temperature + temperature rise due to ripple current heating()
(4) Please use according to the lifetime as noted in this specification. Using products beyond end of the lifetime may change characteristics rapidly,
short-circuit, operate pressure relief vent, or leak electrolyte.
Panasonic Electronic Devices Co.,Ltd.
* This specification guarantees the quality and performance of the product as individual components.
Before use, check and evaluate their compatibility with installed in your products.
* Do not use the products beyond the specifications described in this document.
* Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these
products may cause the loss of human life or other signification damage, such as damage to vehicles (automobile, train, vessel), traffic
lights, medical equipment, aerospace equipment, electric heating appliances, combustion/ gas equipment, rotating equipment, and
disaster/crime prevention equipment.
The system is equipped with a protection circuit and protection device.
The system is equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault.
* Before using the products, carefully check the effects on their quality and performance, and determined whether or not they can be used.
These products are designed and manufactured for general-purpose and standard use in general electronic equipment.
These products are not intended for use in the following special conditions.
1. In liquid, such as Water, Oil, Chemicals, or Organic solvent
2. In direct sunlight, outdoors, or in dust
3. In vapor, such as dew condensation water of resistive element, or water leakage, salty air, or air with a high concentration corrosive
gas, such as Cl2, H2S, NH3, SO2, or NO2
4. In an environment where strong static electricity or electromagnetic waves exist
5. Mounting or placing heat-generating components or inflammables, such as vinyl-coated wires, near these products
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin and other material
7. Using resolvent, water or water-soluble cleaner for flux cleaning agent after soldering.
(In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues)
* Please arrange circuit design for preventing impulse or transitional voltage.
Do not apply voltage, which exceeds the full rated voltage when the capacitors receive impulse voltage, instantaneous high voltage,
high pulse voltage etc.
* Electrolyte is used in the products. Therefore, misuse can result in rapid deterioration of characteristics and functions of each product.
Electrolyte leakage damages printed circuit and affects performance, characteristics, and functions of customer system.
Design, Specifications are subject to change without notice. Contact your nearest Panasonic sales office for the latest specifications prior to purchase and / or use.
Whenever any doubt about safety comes up with this product, please contact us immediately for engineering assistance without fail.
Specifications are typical and may not apply to all applications.
Engineering Draft
CE-VFK-CE-22
Application Guidelines
22
1.3 Common Application Conditions to Avoid
The following misapplication load conditions will cause rapid deterioration of a capacitor’s electrical parameters.
In addition, rapid heating and gas generation within the capacitor can occur, causing the pressure relief vent to operate and resultant leakage
of electrolyte. Under extreme conditions, explosion and fire ignition could result.
The leaked electrolyte is combustible and electrically conductive.
(1) Reverse Voltage
DC capacitors have polarity. Verify correct polarity before insertion. For circuits with changing or uncertain polarity, use DC bipolar
capacitors. DC bipolar capacitors are not suitable for use in AC circuits.
(2) Charge / Discharge Applications
Standard capacitors are not suitable for use in repeating charge/discharge applications. For charge/ discharge applications, consult us
with your actual application condition.
(3) Over voltage
Do not apply voltages exceeding the maximum specified rated voltage. Voltages up to the surge voltage rating are acceptable for
short periods of time.
Ensure that the sum of the DC voltage and the superimposed AC ripple voltage does not exceed the rated voltage.
(4) Ripple Current
Do not apply ripple currents exceeding the maximum specified value. For high ripple current applications, use a capacitor designed for
high ripple currents. In addition, consult us if the applied ripple current is to be higher than the maximum specified value.
Ensure that rated ripple currents that superimposed on low DC bias voltages do not cause reverse voltage conditions.
1.4 Using Two or More Capacitors in Series or Parallel
(1) Capacitors Connected in Parallel
The circuit resistance can closely approximate the series resistance of the capacitor, causing an imbalance of ripple current loads within
the capacitors. Careful wiring methods can minimize the possible application of an excessive ripple current to a capacitor.
(2) Capacitors Connected in Series
Differences in normal DC leakage current among capacitors can cause voltage imbalances.
The use of voltage divider shunt resistors with consideration to leakage currents can prevent capacitor voltage imbalances.
1.5 Capacitor Mounting Considerations
(1) Double-Sided Circuit Boards
Avoid wiring pattern runs, which pass between the mounted capacitor and the circuit board.
(2) Land/ Pad Pattern
The circuit board land / pad pattern size for chip capacitor is specified in the following table.
Land space Enlargement
Land space
[Table of Board Land Size vs. Capacitor Size] [mm]
ABCDEFGH
E(
φ
8×6.5L) 1.8 4.1 5.0 1.3 1.5 1.4 1.5 2.0
F(
φ
8×10.5L) 2.7 4.0 4.7 1.3 1.0 1.7 1.1 2.5
G(
φ
10) 3.9 4.4 4.7 1.3 1.2 1.9 1.1 2.5
H(
φ
12.5) 3.9 6.0 6.9 2.8 1.3 1.9 2.2 2.5
J(
φ
16) 5.8 6.8 6.2 3.6 1.3 1.9 1.7 2.8
K(
φ
18) 5.8 7.3 6.2 3.6 1.8 1.9 1.7 2.8
Size / Dimension
The land pattern and size shall be decided in consideration of mountability, solderbility and strength.
(3) Clearance for Case Mounted Pressure Relief (φ10 mm)
Capacitors with case mounted pressure relief require sufficient clearance to allow for proper pressure relief operation.
The minimum clearance are dependent on capacitor diameters as follows.
(Dia 10mm Dia 16mm : 2mm minimum , Dia 18mm : 3mm minimum)
(4) Wiring Near the Pressure Relief (φ10 mm)
Avoid locating high voltage or high current wiring or circuit board paths above the pressure relief . Flammable, high temperature gas that
exceeds 100 C may be released which could dissolve the wire insulation and ignite.
(5) Circuit Board Patterns Under the Capacitor
Avoid circuit board runs under the capacitor, as an electrical short can occur due to an electrolyte leakage.
1.6 Electrical Isolation of the Capacitor
Completely isolate the capacitor as follows.
Between the cathode and the case and between the anode terminal and other circuit paths.
1.7 Capacitor Sleeve
The laminate coating is intended for marking and identification purposes and is not meant to electrically insulate the capacitor.
Panasonic Electronic Devices Co.,Ltd.
A
B
B
C
C
G
G
H
B
F
E
D
A
Design, Specifications are subject to change without notice. Contact your nearest Panasonic sales office for the latest specifications prior to purchase and / or use.
Whenever any doubt about safety comes up with this product, please contact us immediately for engineering assistance without fail.
Specifications are typical and may not apply to all applications.
Engineering Draft
CE-VFK-CE-22
Application Guidelines
23
2. Capacitor Handling Techniques
2.1 Considerations Before Using
(1) Capacitors have a finite life. Do not reuse or recycle capacitors from used equipment.
(2) Transient recovery voltage may be generated in the capacitor due to dielectric absorption.
If required, this voltage can be discharged with a resistor with a value of about 1kΩ.
(3) Capacitors stored for a long period of time may exhibit an increase in leakage current.
This can be corrected by gradually applying rated voltage in series with a resistor of approximately 1kΩ.
(4) If capacitors are dropped, they can be damaged mechanically or electrically. Avoid using dropped capacitors.
(5) Dented or crushed capacitors should not be used. The seal integrity can be damaged and loss of electrolyte/shortened life can result.
2.2 Capacitor Insertion
(1) Verify the correct capacitance and rated voltage of the capacitor.
(2) Verify the correct polarity of the capacitor before insertion.
(3) Verify the correct hole spacing and land pattern size before insertion to avoid stress on the terminals.
(4) For chip type capacitors, excessive mounting pressure can cause high leakage current, short circuit, or disconnection.
2.3 Manual Soldering
(1) Observe temperature and time soldering specifications or do not exceed temperature of 350 for 3 seconds or less.
(2) If a soldered capacitor must be removed and reinserted, avoid excessive stress on the capacitor leads.
(3) Avoid physical contacts between the tip of the soldering iron and capacitors to prevent or capacitor failure.
2.4 Reflow Soldering
(1) For reflow, use a thermal conduction system such as infrared radiation (IR) or hot blast.
Vapor heat transfer systems (VPS) are not recommended.
(2) Observe proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.
The Temperature on Capacitor top shall be measured by using thermal couple that is fixed firmly by epoxy glue.
(3) Reflow should be performed one time. Consult us for additional reflow restrictions.
2.5 Capacitor Handling after Soldering
(1) Avoid moving the capacitor after soldering to prevent excessive stress on the lead wires where they enter the seal.
(2) Do not use the capacitor as a handle when moving the circuit board assembly.
(3) Avoid striking the capacitor after assembly to prevent failure due to excessive shock.
2.6 Circuit Board Cleaning
(1) Circuit boards can be immersed or ultrasonically cleaned using suitable cleaning solvents for up to 5 minutes
and up to 60 maximum temperatures. The boards should be thoroughly rinsed and dried.
The use of ozone depleting cleaning agents is not recommended for the purpose of protecting our environment.
(2) Avoid using the following solvent groups unless specifically allowed in the specification ;
Halogenated cleaning solvents : except for solvent resistant capacitor types, halogenated solvents can permeate the seal and cause
internal capacitor corrosion and failure.
For solvent resistant capacitors, carefully follow the temperature and time requirements based on the
specification. 1-1-1 trichloroethane should never be used on any aluminum electrolytic capacitor.
Alkaline solvents : could react and dissolve the aluminum case.
Petroleum based solvents : deterioration of the rubber seal could result.
Xylene : deterioration of the rubber seal could result.
Acetone : removal of the ink markings on the vinyl sleeve could result.
(3) A thorough drying after cleaning is required to remove residual cleaning solvents that may be trapped between the capacitor and the circuit
board. Avoid drying temperatures, which exceed the Upper category temperature of the capacitor.
(4) Monitor the contamination levels of the cleaning solvents during use in terms of electrical conductivity, pH, specific gravity, or water content.
Chlorine levels can rise with contamination and adversely affect the performance of the capacitor.
(5) Depending on the cleaning method, the marking on a capacitor may be erased or blurred.
Please consult us if you are not certain about acceptable cleaning solvents or cleaning methods.
2.7 Mounting Adhesives and Coating Agents
When using mounting adhesives or coating agents to control humidity, avoid using materials containing halogenated solvents.
Also, avoid the use of chloroprene based polymers.
Harden on dry adhesive or coating agents well lest the solvent should be left.
After applying adhesives or coatings, dry thoroughly to prevent residual solvents from being trapped between the capacitor and the circuit
board.
2.8 Fumigation
In exporting electronic appliances with aluminum electrolytic capacitors, in some cases fumigation treatment using such halogen
compound as methyl bromide is conducted for wooden boxes.
If such boxes are not dried well, the halogen left in the box is dispersed while transported and enters in the capacitors inside.
This possibly causes electrical corrosion of the capacitors. Therefore, after performing fumigation and drying make sure that no halogen
is left.
Don’t perform fumigation treatment to the whole electronic appliances packed in a box.
Panasonic Electronic Devices Co.,Ltd.

EEV-FK1A222V

Mfr. #:
Manufacturer:
Panasonic
Description:
Aluminum Electrolytic Capacitors - SMD Al Lytic Cap SMT FK SerieAnti-vibrat
Lifecycle:
New from this manufacturer.
Delivery:
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