NUP4105MU
http://onsemi.com
3
PACKAGE DIMENSIONS
UDFN10 2.6x2.6, 0.5P
CASE 517AN−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
E
0.10 C
A3
A
A1
2X
2X
0.10 C
DIM
A
MIN MAX
MILLIMETERS
0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.20 0.30
D 2.60 BSC
D2 2.00 2.25
E 2.60 BSC
1.11 1.36
E2
e 0.50 BSC
K
PIN ONE
REFERENCE
0.08 C
0.10 C
10X
A0.10 C
NOTE 3
L
e
D2
E2
b
B
5
6
10X
1
K
10
10X
10X
0.05 C
0.30 0.40
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.25
1.42
0.50
0.58
10X
2.90
0.30
10X
DIMENSIONS: MILLIMETERS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
B
NOTE 4
0.20 ---
PITCH
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