In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
040606
www.littelfuse.com
2.0
1.0
1.0
2.5
Dimensions (mm)
Solder pad Layout (mm)
Dimensions (mm)
Model A B C D E packaging quantity
Min Max Min Max Min Max Min Min Max tape
SMD1210P005TS/TF 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.20 0.50 3.000
SMD1210P010TS/TF 3.00 3.43 2.35 2.80 0.75 1.25 0.25 0.20 0.50 3.000
SMD1210P020TS/TF 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.20 0.50 3.000
SMD1210P035TS/TF 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50 4.000
SMD1210P050TS/TF 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50 4.000
SMD1210P075TS/TF 3.00 3.43 2.35 2.80 0.50 0.85 0.25 0.20 0.50 4.000
SMD1210P110TS/TF 3.00 3.43 2.35 2.80 0.90 1.30 0.25 0.20 0.50 3.000
SMD1210P150TS/TF 3.00 3.43 2.35 2.80 1.00 1.60 0.25 0.20 0.50 2.000
SMD1210P005TS/TF 0.05 0.15 30 10 1.50 @ 0.25 0.6 3.600 25.000 50.000 • •
SMD1210P010TS/TF 0.10 0.30 30 10 1.50 @ 0.50 0.6 1.600 7.000 15.000 • •
SMD1210P020TS/TF 0.20 0.40 30 10 0.02 @ 8.00 0.6 0.800 2.900 5.000 • •
SMD1210P035TS/TF 0.35 0.70 6 40 0.20 @ 8.00 0.6 0.320 0.810 1.300 • •
SMD1210P050TS/TF 0.50 1.00 13.2 40 0.10 @ 8.00 0.6 0.250 0.550 0.900 • •
SMD1210P075TS/TF 0.75 1.50 6 40 0.10 @ 8.00 0.6 0.130 0.290 0.400 • •
SMD1210P110TS/TF 1.10 2.20 6 40 0.30 @ 8.00 0.6 0.060 0.140 0.210 • •
SMD1210P150TS/TF 1.50 3.00 6 40 0.50 @ 8.00 0.8 0.040 0.070 0.110 • •
cURus
TÜV
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
NOTE:
I
hold
= Hold current: maximum current device will pass without tripping in 20 °C still air.
I
trip
=
Trip current: minimum current at which the device will trip in 20 °C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20 °C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specifi ed rating may result in damage and possible arcing and fl ame.
Specifi cations are subject to change without notice
Model I
hold
I
Trip
V
max. dc
I
max.
max. time to trip P
d max.
Resistance Approvals
(A) (A) (V) (A) (s @ A)
(W)
R
min.
(Ω)
R
typ.
(Ω)
R
I max.
(Ω)
Order Qty. Order- Model Packaging
Information Number
Please choose TS for SnPb and TF for Sn plating
POLYFUSE
®
RESETTABLE FUSES
Specifi cations
Packaging
A Blistertape and reel Ø 178 mm
Materials
Terminals: Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider de-rating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specifi cation RS186-9E,
ANSI/J-STD-002, Category 3
Refl ow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
SMD Type, 6 V - 30 V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
This product line is designed for surface-mount
applications with a range in hold currents from
50 mA to 1.5 A and voltages from 6 V to 30 V.
These smaller devices (1210-mil footprint) are
ideally suited for palm PC, PDAs and applications
where space is constrained and circuit protec-
tion is required.
Suitable for refl ow soldering
SMD1210
