PACDN042
www.onsemi.com
7
PACKAGE DIMENSIONS
SOT23, 6 Lead
CASE 527AJ
ISSUE B
D
A1
5
12
DETAIL A
L
E1
b
A
DETAIL A
c
DIM MIN MAX
MILLIMETERS
A1 0.00 0.15
A2 0.90 1.30
b 0.20 0.50
c 0.08 0.26
D 2.70 3.00
E 2.50 3.10
E1 1.30 1.80
e 0.95 BSC
L2 0.25 BSC
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
0.20 0.60
A --- 1.45
3
64
E
A2
SIDE VIEW
TOP VIEW
END VIEW
A
S
A
M
0.20
6X
SEATING
PLANE
B
C
S
B
e
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
3.30
0.95
0.85
6X
DIMENSIONS: MILLIMETERS
0.56
PITCH
6X
RECOMMENDED
0.10 C
C
6X
SEATING
PLANE
L2
GAGE
PLANE
PACDN042
www.onsemi.com
8
PACKAGE DIMENSIONS
SOT143, 4 Lead
CASE 527AF
ISSUE A
E1 E
A1
e
e1
b
b2
D
c
A
A2
TOP VIEW
SIDE VIEW END VIEW
L1
L2
L
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC TO-253.
SYMBOL
θ
MIN NOM MAX
q
A
A1
A2
b
b2
c
D
E
e
L
L1
0.05
0.75
0.30
0.76
0.40
0.08
2.80
2.10
1.92 BSC
0.54 REF
1.22
0.15
1.07
0.50
0.89
0.60
0.20
3.04
2.64
0.50
0.90
2.90
e1 0.20 BSC
E1 1.20 1.401.30
L2 0.25
0.80
12
43
PACDN042
www.onsemi.com
9
PACKAGE DIMENSIONS
SC70, 3 Lead, 1.25x2
CASE 419AB
ISSUE O
E1
D
A
L
L1
L2
ee
b
A1
A2
c
TOP VIEW
SIDE VIEW END VIEW
q1
q1
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
SYMBOL MIN NOM MAX
E
q
θ
A
A1
b
c
D
E
E1
e
L
L2
0.00
0.15
0.08
0.26
1.80
1.80
1.15
0.65 BSC
0.15 BSC
1.10
0.10
0.30
0.22
0.46
2.20
2.40
1.35
L1
0.80
θ1
10º
A2 0.80 1.00
0.42 REF
0.36
2.00
2.10
1.25
0.90

PACDN045YB6R

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
ESD Suppressors / TVS Diodes 5 TVS array ESD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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