CYRS1542AV18
CYRS1544AV18
Document Number: 001-60006 Rev. *M Page 7 of 34
TCK Input Test clock (TCK) Pin for JTAG.
TDI Input Test data in (TDI) Pin for JTAG.
TMS Input Test mode select (TMS) Pin for JTAG.
NC N/A Not connected to the die. Can be tied to any voltage level.
NC/144M Input Not connected to the die. Can be tied to any voltage level.
NC/288M Input Not connected to the die. Can be tied to any voltage level.
V
REF
Input-
Reference
Reference voltage input. Static input used to set the reference level for HSTL inputs, outputs, and AC
measurement points.
V
DD
Power Supply Power supply inputs to the core of the device.
V
SS
Ground Ground for the device.
V
DDQ
Power Supply Power supply inputs for the outputs of the device.
Pin Definitions (continued)
Pin Name I/O Pin Description
CYRS1542AV18
CYRS1544AV18
Document Number: 001-60006 Rev. *M Page 8 of 34
Functional Overview
The CYRS1542AV18, and CYRS1544AV18 are synchronous
pipelined burst SRAMs with a read port and a write port. The read
port is dedicated to read operations and the write port is
dedicated to write operations. Data flows into the SRAM through
the write port and flows out through the read port. These devices
multiplex the address inputs to minimize the number of address
pins required. By having separate read and write ports, the
QDR II+ completely eliminates the need to turnaround the data
bus and avoids any possible data contention, thereby simplifying
system design. Each access consists of two 18-bit data transfers
in the case of CYRS1542AV18, and two 36-bit data transfers in
the case of CYRS1544AV18 in one clock cycle.
This device operates with a read latency of two cycles when
DOFF
pin is tied HIGH. When DOFF pin is set LOW or connected
to V
SS
then the device behaves in QDR I mode with a read
latency of one clock cycle. DOFF
is not a recommended mode
of operation.
Accesses for both ports are initiated on the rising edge of the
positive input clock (K). All synchronous input timing is
referenced from the rising edge of the input clocks (K and K
) and
all output timing is referenced to the output clocks (K and K
).
All synchronous data inputs (D
[x:0]
) pass through input registers
controlled by the input clocks (K and K
). All synchronous data
outputs (Q
[x:0]
) pass through output registers controlled by the
rising edge of the output clocks (K and K
).
All synchronous control (RPS
, WPS, BWS
[x:0]
) inputs pass
through input registers controlled by the rising edge of the input
clocks (K and K
).
CYRS1542AV18 is described below. The same basic
descriptions also apply to CYRS1544AV18.
Read Operations
The CYRS1542AV18 is organized internally as two arrays of
2 M × 18. Accesses are completed in a burst of two sequential
18-bit data words. Read operations are initiated by asserting
RPS
active at the rising edge of the positive input clock (K). The
address is latched on the rising edge of the K clock. The address
presented to the address inputs is stored in the read address
register. Following the next two K clock rising edges, the
corresponding lower order 18-bit word of data is driven onto the
Q
[17:0]
using K as the output timing reference. On the
subsequent rising edge of K
, the next 18-bit data word is drive
onto the Q
[17:0]
. The requested data is valid 0.45 ns from the
rising edge of the output clock (K or K
).
When the read port is deselected, the CYRS1542AV18 first
completes the pending read transactions. Synchronous internal
circuitry automatically tri-states the outputs following the next
rising edge of the positive input clock (K).
Write Operations
Write operations are initiated by asserting WPS active at the
rising edge of the positive input clock (K). On the same K clock
rise the data presented to D
[17:0]
is latched and stored into the
lower 18-bit write data register, provided BWS
[1:0]
are both
asserted active. On the subsequent rising edge of the negative
input clock (K), the address is latched in and the information
presented to D
[17:0]
is stored into the higher 18-bit write data
register, provided BWS
[1:0]
are both asserted active. The 36 bits
of data are then written into the memory array at the specified
location.
When deselected, the write port ignores all inputs after the
pending write operations are complete.
Byte Write Operations
Byte write operations are supported by the CYRS1542AV18. A
write operation is initiated as described in the Write Operations
section. The bytes that are written are determined by BWS
0
and
BWS
1
, which are sampled with each set of 18-bit data words.
Asserting the appropriate BWS input during the data portion of a
write latches the data being presented and writes it into the
device. Deasserting the byte write select input during the data
portion of a write enables the data stored in the device for that
byte to remain unaltered. This feature can be used to simplify
read, modify, or write operations to a byte write operation.
Concurrent Transactions
The read and write ports on the CYRS1542AV18 operate
independently of one another. As each port latches the address
inputs on different clock edges, you can read or write to any
location, regardless of the transaction on the other port. You can
start reads and writes in the same clock cycle. If the ports access
the same location at the same time, the SRAM delivers the most
recent information associated with the specified address
location. This includes forwarding data from a write cycle that
was initiated on the previous K clock rise.
Depth Expansion
The CYRS1542AV18 has a port select input for each port. This
allows for easy depth expansion. Both port selects are sampled
on the rising edge of the positive input clock only (K). Each port
select input can deselect the specified port. Deselecting one port
does not affect the other port. All pending transactions (read and
write) are completed before the device is deselected.
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and V
SS
to enable the SRAM to adjust its output
driver impedance. The value of RQ must be 5 × the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175 and 350
, with V
DDQ
=1.5 V. The
output impedance is adjusted every 1024 cycles upon power-up
to account for drifts in supply voltage and temperature.
CYRS1542AV18
CYRS1544AV18
Document Number: 001-60006 Rev. *M Page 9 of 34
Echo Clocks
Echo clocks are provided on the QDR II+ to simplify data capture
on high speed systems. Two echo clocks are generated by the
QDRII+. CQ is referenced with respect to K and CQb is
referenced with respect to K
. These are free-running clocks and
are synchronized to the input clock of the QDR II+. The timing
for the echo clocks is shown in Switching Characteristics on page
25.
Valid Data Indicator (QVLD)
QVLD is provided on the QDR II+ to simplify data capture on high
speed systems. The QVLD is generated by the QDR II+ device
along with data output. This signal is also edge-aligned with the
echo clock and follows the timing of any data pin. This signal is
asserted half a cycle before valid data arrives.
DLL
These chips use a DLL that is designed to function between
120 MHz and the specified maximum clock frequency. During
power-up, when the DOFF is tied HIGH, the DLL is locked after
10240 cycles of stable clock. The DLL can also be reset by
slowing or stopping the input clocks K and K for a minimum of
30 ns. The DLL may be disabled by applying ground to the DOFF
pin. When the DLL is turned off, the device behaves in QDR I
mode (with one cycle latency and a longer access time). For
information refer to the application note AN5062, DLL Consider-
ations in QDRII/DDRII.
Qualification and Screening
The 90-nm RadStop technology was qualified by Cypress after
meeting the criteria of the General Manufacturing Standards.
The test flow includes screening units with the defined flow
(Class Q, Class V) and the appropriate periodic or lot
conformance testing (Groups B, C, D, and E). Both the 90-nm
process and the SRAM products are subject to period or
lot-based technology conformance inspection (TCI) and quality
conformance inspection (QCI) tests, respectively. Cypress offers
both prototyping models and flight units of these product
configurations.
Table 1. Qualification Tests
Group A General electrical tests
Group B Mechanical - Dimensions,
bond strength, solvents, die
shear, solderability, lead
Integrity, seal, and
acceleration
Group C Life tests - 1000 hours at
125 C or equivalent
Group D Package related mechanical
tests - shock, vibration, accel,
salt, seal, lead finish adhesion,
lid torque, thermal shock, and
moisture resistance
Group E Radiation tests

5962F1120101QXA

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM Sync SRAMs
Lifecycle:
New from this manufacturer.
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